高通评估三星2nm工艺用于下一代芯片
高通正对三星电子的2纳米代工工艺进行初步评估，用于可能生产下一代应用处理器（AP）。高通高管Chris Patrick就此事表态。该评估涉及三星2nm制程能否承接高通下一代AP的代工订单，与晶圆代工产能及元器件供应链相关。
原文深度解读
本文报道高通（Qualcomm）正对三星电子（Samsung Electronics）的2纳米代工工艺进行初步评估，用于可能生产下一代应用处理器（AP）。高通高管Chris Patrick在2026年9月22日于毛伊岛举行的Snapdragon Summit 2026上对韩国记者表示，三星是高通在全球移动产业中最强的合作伙伴，高通正在深入研究如何将2nm技术用于下一代产品。但原文明确指出目前没有立即安排代工生产的产品，也没有最终确定的计划，高通仍处于初步评估和审查阶段。文章还涉及高通与三星在LPDDR6 DRAM上的合作、Snapdragon 8 Elite Gen 6系列（Extreme与标准版）的GPU与封装差异、offset PoP散热技术，以及agentic AI可能推动高端智能手机换机需求。与电子元器件供应链的关系在于：若评估推进，三星2nm代工产能可能重新进入高通AP供应体系，同时LPDDR6内存验证与高端AP封装技术演进也会影响上游晶圆代工、存储与封装环节。
- 高通高管Chris Patrick在2026年9月22日于毛伊岛举行的Snapdragon Summit 2026上表示，三星电子是高通在全球移动产业中最强的合作伙伴，高通正在深入研究如何将2nm技术用于下一代产品。
- 原文明确说明，目前没有立即安排代工生产的产品，也没有最终确定的计划；高通处于初步评估和审查阶段，目的是了解三星代工的2nm半导体工艺节点并评估其生产下一代芯片组的潜力。
- 高通与三星上一次代工合作是2021年的第一代Snapdragon 8；自2022年起，高通的Snapdragon芯片全部由台积电（TSMC）生产。
- 高通Snapdragon芯片持续用于三星电子旗舰Galaxy S系列智能手机，最近Snapdragon 8 Elite Gen 5被用于Galaxy S26系列。
- 双方还在LPDDR6 DRAM的规格、实现和开发上密切合作；三星电子16GB LPDDR6的I/O速度最高达10.7 Gbps，已在高通下一代Snapdragon 8 Elite Gen 6系列上完成验证。
- Snapdragon 8 Elite Gen 6系列分为Extreme和标准版：Extreme在GPU能力和封装上有额外优势，GPU集成矩阵加速引擎并拥有18MB HPM，标准Elite为12MB HPM；Extreme还首次采用offset PoP，将内存封装移向AP上表面侧边，并在AP暴露部分直接放置heat slug，以降低芯片顶部热阻并延长峰值性能持续时间。
供应链影响
- 若高通对三星2nm工艺的初步评估推进到量产阶段，三星代工可能重新进入高通下一代AP的晶圆代工供应体系，从而可能改变目前由台积电独家代工Snapdragon芯片的格局；但原文明确尚无最终计划，实际影响取决于后续评估结果。
- 三星16GB LPDDR6已在高通下一代Snapdragon 8 Elite Gen 6系列上完成验证，这可能增强三星存储产品与高通下一代AP平台在高端智能手机中的配套关系，但具体采用规模取决于终端产品设计。
- Snapdragon 8 Elite Gen 6 Extreme采用offset PoP与heat slug，可能对高端AP封装与散热材料环节提出新的配套要求，相关供应链影响取决于该型号的实际出货情况。
- 原文提到内存价格上涨等挑战性市场条件，同时高通预计agentic AI可能推动高端智能手机需求，这可能影响高端AP、LPDDR6等元器件的需求结构，但需求变化仍取决于消费者对agentic AI体验的接受程度。
- 高通与三星在LPDDR6规格、实现和开发上的长期合作，以及Snapdragon芯片持续用于Galaxy S系列，可能使双方在高端移动平台的存储与AP协同上保持较强绑定，但未来合作范围取决于具体产品规划。
系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。
高通高管Chris Patrick，高通高级副总裁兼移动手机业务总经理，与韩国记者交谈。（照片：THE ELEC，毛伊岛）
高通正在对三星电子的2纳米代工工艺进行初步评估，用于可能生产下一代应用处理器（AP）。
高通高级副总裁兼移动手机业务总经理Chris Patrick于当地时间9月22日在毛伊岛举行的Snapdragon Summit 2026上表示，三星电子是高通在全球移动产业中最强的合作伙伴。他说：“我们正在深入研究如何将2nm技术用于我们的下一代产品。”
然而，目前没有立即安排代工生产的产品，也没有最终确定的计划。高通处于初步评估和审查阶段，试图了解三星代工的2nm半导体工艺节点，并评估其生产下一代芯片组的潜力。
两家公司上一次代工生产合作是2021年的第一代Snapdragon 8。自2022年以来，高通一直只在台积电生产其Snapdragon芯片。
高通的Snapdragon芯片继续为三星电子的旗舰Galaxy S系列智能手机提供动力。最近，Snapdragon 8 Elite Gen 5被用于Galaxy S26系列。
两家公司还在低功耗双倍数据速率6（LPDDR6）DRAM的规格、实现和开发方面密切合作。三星电子的16GB LPDDR6，输入/输出（I/O）速度最高达10.7吉比特每秒（Gbps），已在高通下一代Snapdragon 8 Elite Gen 6系列上完成验证。
该芯片组也可能用于三星电子的移动产品。Patrick说：“有些公司我们已在多条产品线上长期密切合作。我们乐观地认为，他们将继续在高通下一代平台上与我们合作。”
◇ Snapdragon 8 Elite Extreme扩展顶级选项
Snapdragon 8 Elite Gen 6系列由Extreme和标准型号组成。（照片：高通）
Snapdragon 8 Elite Gen 6系列由Extreme和标准型号组成。Extreme型号在图形处理单元（GPU）能力和封装方面提供额外优势。其额外GPU功能包括内部矩阵加速引擎和更大的Adreno高性能内存（HPM）容量。
Patrick说：“Snapdragon 8 Elite Extreme Gen 6在GPU中集成了矩阵加速引擎，并拥有18MB HPM。标准Elite型号拥有12MB HPM。”
Extreme型号还首次采用offset package-on-package（PoP），这是一种旨在改善散热的技术，相比传统PoP更优。在传统PoP中，DRAM封装垂直堆叠在智能手机AP封装顶部，限制了AP通过顶部散热的能力。
Offset PoP将内存封装移向AP上表面的侧边。heat slug直接放置在AP暴露的部分上，显著降低芯片顶部热阻，并允许峰值性能维持更长时间。
Patrick说：“智能手机是人们经济活动、工作和与家人联系的必要设备，尽管面临内存价格上涨等挑战性市场条件，对高端设备的需求仍在持续增长。为回应这一趋势，我们决定对产品线进行细分，使Extreme能够提供最佳体验，而标准型号提供可靠性能。”
◇ Agentic AI可能推动智能手机换机需求
高通高级副总裁兼移动手机业务总经理Chris Patrick听取韩国记者的提问。（照片：THE ELEC，毛伊岛）
高通预计agentic AI将推动高端智能手机需求，因为agentic AI系统能够以现有系统无法做到的方式充分利用设备性能和功能。
据高通称，大多数用户通常只使用了智能手机约10%的功能，因为消费者很难理解和使用设备上所有可用功能。
相比之下，agentic AI可以根据用户意图挖掘设备的全部潜力。这提高了高性能AP的利用率，并给消费者一个购买搭载顶级芯片组旗舰智能手机的理由。
Patrick说：“智能手机的实用性和重要性持续增加。一旦消费者体验到agentic AI系统的价值，他们就会投资于规格更好的设备，或缩短换机周期。”
Chris Patrick, Qualcomm senior vice president and general manager of mobile handsets, speaks with Korean reporters. (Photo: THE ELEC, Maui)
Qualcomm is conducting a preliminary evaluation of Samsung Electronics' 2-nanometer foundry process for potential production of next-generation application processors (APs).
Chris Patrick, Qualcomm senior vice president and general manager of mobile handsets, said at Snapdragon Summit 2026 in Maui on Sept. 22 local time that Samsung Electronics is Qualcomm's strongest partner in the global mobile industry. "We are taking a deep look at how we can leverage 2nm technology for our next-generation products," he said.
However, there is no product immediately slated for foundry production or any finalized plan. Qualcomm is at the preliminary evaluation and review stage, seeking to understand Samsung Foundry's 2nm semiconductor process node and assess its potential for producing next-generation chipsets.
The companies last collaborated on foundry production with the first-generation Snapdragon 8 in 2021. Since 2022, Qualcomm has produced its Snapdragon chips exclusively at TSMC.
Qualcomm's Snapdragon chips continue to power Samsung Electronics' flagship Galaxy S series smartphones. Most recently, the Snapdragon 8 Elite Gen 5 was used in the Galaxy S26 series.
The companies have also worked closely on specifications, implementation and development of low-power double data rate 6 (LPDDR6) DRAM. Samsung Electronics' 16GB LPDDR6, with input/output (I/O) speeds of up to 10.7 gigabits per second (Gbps), was validated on Qualcomm's next-generation Snapdragon 8 Elite Gen 6 series.
The chipset is also likely to be used in Samsung Electronics' mobile products. "There are companies we have worked closely with over the long term across multiple product lines," Patrick said. "We are optimistic that they will continue working with Qualcomm on our next-generation platforms."
◇ Snapdragon 8 Elite Extreme Expands Top-Tier Options
The Snapdragon 8 Elite Gen 6 lineup consists of Extreme and standard models. (Photo: Qualcomm)
The Snapdragon 8 Elite Gen 6 lineup consists of Extreme and standard models. The Extreme model offers additional advantages in graphics processing unit (GPU) capabilities and packaging. Its additional GPU features include an internal matrix acceleration engine and increased Adreno High Performance Memory (HPM) capacity.
"The Snapdragon 8 Elite Extreme Gen 6 has a matrix acceleration engine integrated into the GPU and 18MB of HPM," Patrick said. "The standard Elite model has 12MB of HPM."
The Extreme model is also the first to use offset package-on-package (PoP), a technology designed to improve heat dissipation compared with conventional PoP. In traditional PoP, the DRAM package is stacked vertically on top of the smartphone AP package, limiting the ability to dissipate heat from the AP through the top.
Offset PoP positions the memory package toward the side of the AP's upper surface. A heat slug is placed directly on the exposed portion of the AP, significantly reducing thermal resistance at the top of the chip and allowing peak performance to be sustained for longer.
"Smartphones are essential devices for people's economic activities, work and connections with family, and demand for premium devices continues to grow despite challenging market conditions such as rising memory prices," Patrick said. "In response to that trend, we decided to segment the lineup so the Extreme can deliver the best experience while the standard model provides solid performance."
◇ Agentic AI Could Drive Smartphone Replacement Demand
Chris Patrick, Qualcomm senior vice president and general manager of mobile handsets, listens to a question from Korean reporters. (Photo: THE ELEC, Maui)
Qualcomm expects agentic AI to drive demand for high-end smartphones because agentic AI systems can make full use of a device's performance and features in ways that existing systems could not.
According to Qualcomm, most users have typically used only about 10% of their smartphone's features because it is difficult for consumers to understand and use every function available on their devices.
Agentic AI, by contrast, can tap the device's full potential based on a user's intent. That increases utilization of high-performance APs and gives consumers a reason to buy flagship smartphones equipped with top-tier chipsets.
"The usefulness and importance of smartphones continue to increase," Patrick said. "Once consumers experience the value of agentic AI systems, they will invest in better-specced devices or shorten their replacement cycles."