OCI携手日本伙伴进军半导体晶圆再生市场
OCI公司准备通过与一家日本专业公司合作进入半导体晶圆再生业务。作为该计划的一部分，OCI计划将OCI Specialty的工厂改造为晶圆再生设施。此举旨在拓展半导体材料相关业务，与供应链中的晶圆再利用环节相关联。
原文深度解读
OCI公司计划通过与一家日本专业公司合作进入半导体晶圆再生业务，将OCI Specialty位于公州的工厂（原用于太阳能材料生产）改造为半导体材料制造基地。该业务聚焦于先进封装中使用的载片晶圆再生，特别是高带宽存储器（HBM）生产中的载片。OCI计划投资约254亿韩元，目标2027年10月投产。此举旨在拓展半导体材料业务，与晶圆再利用供应链环节相关。
- OCI计划通过与一家日本专业公司合作进入半导体晶圆再生业务，合作讨论仍处于早期阶段，具体条款未最终确定。
- OCI Specialty目前不具备晶圆再生技术，需要外部技术合作，因为晶圆再生需要与晶圆制造相当的技术和工艺诀窍。
- OCI的目标业务是再生半导体封装工艺中使用的载片晶圆，特别是用于HBM生产的载片。
- 载片晶圆成本约为每片10万韩元，目前主要作为一次性材料使用；随着HBM生产扩大，载片需求快速增长，推动了对再生技术的兴趣。
- SK海力士使用硅基载片，三星电子同时使用硅基和玻璃基载片，且玻璃基载片比例相对较高。
- OCI计划投资约254亿韩元于公州工厂，并于2027年10月开始商业生产。
供应链影响
- OCI进入晶圆再生市场可能增加载片晶圆再生供应，从而影响HBM供应链中载片的成本结构，具体取决于其技术成熟度和客户接受度。
- OCI的化学品业务（如半导体级过氧化氢）可能与其再生工艺产生协同效应，但实际效果取决于工艺整合和客户验证。
- 日本合作伙伴的引入可能带来技术转移，但合作结构未定，可能影响项目时间表。
- 随着HBM需求增长，载片再生需求可能上升，但OCI的市场份额取决于与现有厂商（如Fujimi、Mimasu、A-Tech Solution）的竞争。
- OCI的再生业务可能降低客户对一次性载片的依赖，但客户采用取决于再生晶圆的质量和可靠性验证。
系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。
晶圆支撑系统（WSS）示意图。（来源：SK海力士）
OCI正准备通过与一家日本专业公司合作进入半导体晶圆再生业务。作为该计划的一部分，公司计划将OCI Specialty位于公州的工厂（此前用于太阳能材料生产）改造为半导体材料制造基地。
据多位行业消息人士8月3日透露，OCI正在寻求与一家日本公司在晶圆再生领域的合作。由于OCI Specialty在晶圆再生运营方面没有经验，预计公司将引入外部技术以建立初始生产工艺并支持客户接洽。讨论仍处于早期阶段，具体合作条款尚未最终确定。
“OCI正准备通过与一家日本公司的合作开展封装晶圆再生业务，”一位行业消息人士表示。“然而，该项目仍处于早期阶段，合作伙伴和合作结构均在讨论中。”
另一位消息人士表示：“OCI Specialty目前不具备晶圆再生技术，因此外部技术合作是必要的。晶圆再生是一项需要与晶圆制造本身相当的技术和工艺诀窍的业务。”
OCI瞄准的新业务领域是再生半导体封装工艺中使用的载片晶圆。晶圆再生市场通常分为两类：再生前端半导体制造中使用的测试片和假片，以及再生先进封装工艺中使用的载片。OCI计划专注于用于高带宽存储器（HBM）生产的载片。
在HBM封装中，器件晶圆通过粘合材料临时键合到载片晶圆上。由于HBM垂直堆叠多个存储芯片，需要进行背面处理步骤，如凸块形成。在背面研磨过程中，器件晶圆被减薄至几十微米，增加了翘曲或断裂的风险。载片晶圆在这些过程中提供结构支撑，实现稳定制造。背面处理完成后，通过解键合工艺将晶圆分离。
分离后，粘合剂残留物和有机材料残留在载片晶圆表面。再生工艺通过化学处理（通常使用硫酸和过氧化氢溶液）去除残留物，然后进行清洗和检查，使晶圆恢复可重复使用状态。
载片晶圆成本约为每片10万韩元，目前主要作为一次性材料使用。随着HBM生产扩大，载片需求快速增长，推动了人们对再生技术作为降低成本措施的兴趣。SK海力士使用硅基载片，而三星电子同时使用硅基和玻璃基载片，行业消息人士称三星运营中玻璃基载片比例相对较高。
晶圆再生行业的主要参与者包括日本的Fujimi和Mimasu Semiconductor Industry。在韩国，A-Tech Solution等公司活跃于该领域。
OCI现有的化学品业务被视为潜在竞争优势。晶圆再生工艺高度依赖清洗技术，使用硫酸和过氧化氢去除粘合剂和有机材料。行业观察人士认为，OCI的半导体级过氧化氢和超高纯度化学品业务可能在工艺管理和质量控制方面产生协同效应。
在上个月的第二季度财报电话会议上，OCI表示将通过OCI Specialty进入半导体封装晶圆再生业务，OCI Specialty已从OCI Holdings转移。公司计划在公州工厂投资约254亿韩元，并于2027年10月开始商业生产。
“这项业务涉及收集先进半导体封装工艺中使用的各种材料制成的晶圆，对其进行清洗和再生，然后供应给客户，”OCI表示。“由于包括与客户讨论在内的各种原因，我们目前无法披露确切的产品名称。”
公司补充说，该业务预计将随着HBM市场的扩大而增长，并计划通过这一举措继续扩大其半导体材料组合。
Illustration of a Wafer Support System (WSS). (Source: SK hynix)
OCI is preparing to enter the semiconductor wafer reclaim business through cooperation with a specialized Japanese company. As part of the initiative, the company plans to transform OCI Specialty’s plant in Gongju, previously used for solar materials production, into a semiconductor materials manufacturing base.
According to multiple industry sources on Aug. 3, OCI is pursuing collaboration with a Japanese company in the wafer reclaim sector. Because OCI Specialty has no prior experience in wafer reclaim operations, the company is expected to introduce external technology to establish initial production processes and support customer engagement. Discussions remain at an early stage, and specific cooperation terms have not yet been finalized.
“OCI is preparing a packaging wafer reclaim business through a partnership with a Japanese company,” one industry source said. “However, the project is still in its early stages, and both the partner and cooperation structure remain under discussion.”
Another source said, “OCI Specialty does not currently possess wafer reclaim technology, making external technical cooperation necessary. Wafer reclaim is a business that requires technology and process know-how comparable to wafer manufacturing itself.”
The new business area targeted by OCI is reclaiming carrier wafers used in semiconductor packaging processes. The wafer reclaim market is generally divided into two categories: reclaiming test and dummy wafers used in front-end semiconductor manufacturing and reclaiming carrier wafers used in advanced packaging processes. OCI plans to focus on carrier wafers used in the production of high-bandwidth memory (HBM).
In HBM packaging, device wafers are temporarily bonded to carrier wafers using adhesive materials. Because HBM stacks multiple memory chips vertically, backside processing steps such as bump formation are required. During back-grinding, device wafers are thinned to tens of micrometers, increasing the risk of warping or breakage. Carrier wafers provide structural support during these processes, enabling stable manufacturing. After backside processing is completed, the wafers are separated through a debonding process.
Following separation, adhesive residues and organic materials remain on the carrier wafer surface. Reclaim processes restore the wafers for reuse by removing residues through chemical treatment, typically using sulfuric acid and hydrogen peroxide solutions, followed by cleaning and inspection.
Carrier wafers cost roughly 100,000 won each and are currently used primarily as disposable materials. As HBM production expands, demand for carrier wafers is increasing rapidly, driving interest in reclaim technologies as a cost-reduction measure. SK hynix uses silicon-based carrier wafers, while Samsung Electronics utilizes both silicon- and glass-based carrier wafers, with industry sources indicating a relatively high proportion of glass carrier wafers in Samsung’s operations.
Major players in the wafer reclaim industry include Japan’s Fujimi and Mimasu Semiconductor Industry. In South Korea, companies such as A-Tech Solution are active in the sector.
OCI’s existing chemicals business is viewed as a potential competitive advantage. Wafer reclaim processes rely heavily on cleaning technologies that remove adhesives and organic materials using sulfuric acid and hydrogen peroxide. Industry observers believe OCI’s semiconductor-grade hydrogen peroxide and ultra-high-purity chemical businesses could create synergies in process management and quality control.
During its second-quarter earnings conference call last month, OCI said it would enter the semiconductor packaging wafer reclaim business through OCI Specialty, which was transferred from OCI Holdings. The company plans to invest approximately 25.4 billion won in the Gongju facility and begin commercial production in October 2027.
“This business involves collecting wafers made from various materials used in advanced semiconductor packaging processes, cleaning and reclaiming them, and supplying them back to customers,” OCI said. “For various reasons, including discussions with customers, we cannot currently disclose the exact product names.”
The company added that the business is expected to grow alongside the expanding HBM market and that it plans to continue broadening its semiconductor materials portfolio through this initiative.