泰成开设天安新工厂，产能最高扩至七倍
泰成于7月31日在韩国忠清南道天安市为新制造工厂举行开业典礼，约350名PCB客户及行业嘉宾出席。新工厂将产能最高扩大至七倍，旨在满足PCB相关元器件需求。此举将增强其供应链能力，对电子元器件市场供应格局产生影响。
原文深度解读
本文报道了韩国PCB设备制造商Taesung于7月31日在韩国忠清南道天安市为新制造工厂举行开业典礼，约350名PCB客户及行业嘉宾出席。新工厂总建筑面积约17,950坪，是现有安山工厂（4,120坪）的约4.35倍，预计将产能最高扩大至六到七倍。公司计划从8月中旬起逐步将现有安山工厂的制造设备（包括PCB生产系统）转移至新工厂，新工厂将作为总部和主要制造基地。此举旨在满足PCB相关元器件需求，并支持AI半导体封装市场增长，对电子元器件供应链的供应能力产生潜在影响。
- Taesung于7月31日在韩国忠清南道天安市为新制造工厂举行开业典礼，约350名PCB客户及行业嘉宾出席。
- 出席者包括大德电子总裁Shin Young-hwan、TLB总裁Cho Seung-geon、Simmtech高级执行副总裁Son Gil-dong、Korea Circuit执行副总裁Lim Chul-hong。
- Taesung以制造PCB生产设备闻名，近年来扩展到下一代半导体封装设备和材料，包括玻璃基板蚀刻和电镀系统以及复合铜箔技术。
- 新工厂总建筑面积约17,950坪，是现有安山工厂（4,120坪）的约4.35倍。公司于2025年9月购地，2026年5月开工，6月获得入住批准。
- 公司预计新工厂将产能最高扩大六到七倍，支持PCB制造设备、玻璃基板蚀刻和电镀系统、复合铜箔设备和材料的更高产量。
- 公司计划从8月中旬起逐步将现有安山工厂的制造设备（包括PCB生产系统）转移至新工厂，安山工厂目前继续生产以满足客户交付计划。
供应链影响
- 新工厂产能扩大可能增加PCB制造设备及相关材料的供应量，从而影响电子元器件供应链中设备端的供给能力。
- 产能提升可能缩短客户订单的交付周期，具体取决于设备转移和稳定化的进度。
- 公司对AI半导体封装市场的布局可能带动玻璃基板和复合铜箔相关材料和设备的供应增长，进而影响上游材料供应链。
- 安山工厂的逐步转移可能导致短期内生产调整，可能影响现有订单的交付，取决于转移过程的效率。
- 新工厂作为总部和主要制造基地，可能增强公司对客户需求的响应能力，但实际影响取决于产能爬坡和市场订单情况。
系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。
泰成CEO金钟学（左六）及主要出席者于7月31日在新天安工厂开业典礼上举行竣工仪式。（照片：THE ELEC）
泰成于7月31日在忠清南道天安市为其新制造工厂举行开业典礼，吸引了约350名来自印刷电路板（PCB）客户和行业合作伙伴的嘉宾。
出席者包括大德电子总裁Shin Young-hwan、TLB总裁Cho Seung-geon、Simmtech高级执行副总裁Son Gil-dong、Korea Circuit执行副总裁Lim Chul-hong。
泰成以制造PCB生产设备而闻名。近年来，公司已扩展到下一代半导体封装的设备和材料，包括玻璃基板蚀刻和电镀系统以及复合铜箔技术。
“泰成在过去27年中与客户共同成长，”首席执行官金钟学在仪式上表示。“凭借新的天安工厂，我们将进一步加强支持客户的能力，并通过最高水平的技术和质量回报他们的信任。”
金补充说，公司计划通过扩大生产能力和研发能力，在玻璃基板和复合铜箔工艺设备等领域培育PCB设备之外的未来增长业务。
泰成CEO金钟学于7月31日在新天安制造工厂开业典礼上发表讲话。（照片：THE ELEC）
仪式在新工厂的生产综合体B栋举行。从8月中旬开始，泰成计划逐步将包括PCB生产系统在内的制造设备从现有的安山工厂转移过来。目前安山工厂继续生产以满足客户交付计划。新工厂将在设备安装和稳定后开始全面运营。
天安工厂将作为公司的总部和主要制造基地。A栋设有办公空间和部分生产设施，而B栋专门用于制造运营。
该综合体总建筑面积约17,950坪，约为泰成现有安山工厂（4,120坪）的4.35倍。公司于2025年9月购地，2026年5月开工，6月获得入住批准。
随着新工厂的竣工，泰成预计将产能最高扩大六到七倍。此次扩张将支持PCB制造设备以及玻璃基板蚀刻和电镀系统、复合铜箔设备和材料的更高产量。
公司表示，新工厂将增强其响应客户订单和交付计划的能力，同时支持与不断扩大的AI半导体封装市场相关的未来增长机会。
Kim Jong-hak, CEO of Taesung (sixth from left), and key attendees perform the completion ceremony at the opening of the company's new Cheonan plant on July 31. (Photo: THE ELEC)
Taesung held an opening ceremony on July 31 for its new manufacturing facility in Cheonan, South Chungcheong Province, drawing approximately 350 guests from printed circuit board (PCB) customers and industry partners.
Attendees included Shin Young-hwan, president of Daeduck Electronics, Cho Seung-geon, president of TLB, Son Gil-dong, senior executive vice president of Simmtech, and Lim Chul-hong, executive vice president of Korea Circuit.
Taesung is best known for manufacturing PCB production equipment. In recent years, the company has expanded into equipment and materials for next-generation semiconductor packaging, including glass substrate etching and plating systems as well as composite copper foil technologies.
"Taesung has grown together with its customers over the past 27 years," Chief Executive Officer Kim Jong-hak said during the ceremony. "With the new Cheonan facility, we will further strengthen our ability to support customers and repay their trust through the highest levels of technology and quality."
Kim added that the company plans to foster future growth businesses beyond PCB equipment by expanding production capacity and research and development capabilities in areas such as glass substrate and composite copper foil process equipment.
Kim Jong-hak, CEO of Taesung, delivers remarks during the opening ceremony of the company's new Cheonan manufacturing facility on July 31. (Photo: THE ELEC)
The ceremony was held in Building B, the facility's new production complex. Beginning in mid-August, Taesung plans to gradually transfer manufacturing equipment, including PCB production systems, from its existing plant in Ansan. Production currently continues at the Ansan site to meet customer delivery schedules. Full-scale operations at the new plant will begin following equipment installation and stabilization.
The Cheonan facility will serve as both the company's headquarters and primary manufacturing base. Building A houses office space and selected production facilities, while Building B is dedicated to manufacturing operations.
The complex has a total floor area of approximately 17,950 pyeong, making it about 4.35 times larger than Taesung's existing 4,120-pyeong facility in Ansan. The company acquired the site in September 2025, began construction in May 2026 and received occupancy approval in June.
With the completion of the new facility, Taesung expects to increase production capacity by as much as six to seven times. The expansion will support higher output of PCB manufacturing equipment as well as glass substrate etching and plating systems and composite copper foil equipment and materials.
The company said the new plant will strengthen its ability to respond to customer orders and delivery schedules while supporting future growth opportunities linked to the expanding AI semiconductor packaging market.