AT&S扩大与Marvell Technology的AI基础设施协议
奥地利IC载板与PCB制造商AT&S与半导体公司Marvell Technology签署扩大后的长期协议，为下一代AI与云基础设施供应先进IC载板。
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本文报道奥地利IC载板与PCB制造商AT&S与半导体公司Marvell Technology签署扩大后的长期协议，为下一代AI与云基础设施供应先进IC载板。Marvell被确认为AT&S此前在马来西亚居林（Kulim）工厂扩建中提到的额外客户；该扩建包括Plant 2的装修以及新建用于IC载板芯板和先进封装的设施。文章还提到半导体设计从单片芯片向chiplet架构转变，推动更大载板尺寸、更高集成密度和更多层数需求。
- AT&S与Marvell Technology签署扩大后的长期协议，供应先进IC载板，用于下一代AI与云基础设施。
- Marvell Technology是AT&S此前在马来西亚居林（Kulim）工厂扩建中提到的额外客户；该扩建包括Plant 2的装修以及新建IC载板芯板和先进封装设施。
- AT&S指出，半导体设计从单片芯片向chiplet架构转变，增加了更广泛应用对先进载板的需求，涵盖定制AI加速器到异构计算平台。
- AT&S将更大载板尺寸、更高集成密度和更多层数列为关键驱动因素。
- AT&S CEO Michael Mertin表示，Marvell是AI和数据基础设施领域领先创新者之一，双方有能力把握全球AI基础设施建设带来的重大机遇。
- 居林扩建由长期客户承诺支持，Marvell现已被确认为AT&S此前在扩建中提到的客户；Marvell高级副总裁兼首席供应链官Vinay Krishna表示，随着数据中心业务持续扩张，确保支持客户所需的制造产能和先进技术能力仍是关键优先事项。
供应链影响
- AT&S在马来西亚居林的IC载板产能扩建可能增加面向AI与云基础设施的先进载板供应，但实际产出取决于Plant 2装修和新设施建设进度。
- Marvell作为长期客户承诺可能为居林扩建提供需求可见性，从而可能影响AT&S在先进载板领域的产能分配和投资节奏。
- chiplet架构和异构计算平台普及可能持续推动对更大尺寸、更高层数和更高集成密度载板的需求，进而可能影响载板供应链的技术门槛和产能结构。
- AI基础设施建设带来的载板需求增长可能使先进IC载板环节的产能和交期受到关注，但具体影响取决于客户订单落地和行业扩产速度。
- Marvell强调确保制造产能和先进技术能力，可能反映其供应链策略倾向于与载板供应商建立长期锁定关系，但实际效果取决于协议执行和市场需求变化。
系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。
© AT&S
PCB | 2026年9月24日
Evertiq
奥地利IC载板与PCB制造商AT&S已与半导体公司Marvell Technology签署扩大后的长期协议，为下一代AI与云基础设施供应先进IC载板。
Marvell Technology正是AT&S此前在马来西亚居林（Kulim）制造基地扩建中提到的额外客户。据新闻稿称，该扩建包括Plant 2的装修，以及新建一座用于IC载板芯板和先进封装的设施。
该协议反映出半导体设计领域更广泛的结构性转变。从单片芯片向基于chiplet的设计过渡，正在增加更广泛应用对先进载板的需求——从定制AI加速器到异构计算平台。AT&S指出，更大载板尺寸、更高集成密度和更多层数是关键驱动因素。
“Marvell Technology是半导体行业在AI和数据基础设施领域领先的创新者之一，我们携手处于有利位置，以把握全球AI基础设施建设所创造的重大机遇。”AT&S首席执行官Michael Mertin表示。
居林扩建由长期客户承诺支持，Marvell Technology现已被确认为AT&S此前在扩建中提到的客户。
“随着我们的数据中心业务持续扩张，确保支持客户所需的制造产能和先进技术能力仍是一项关键优先事项。”Marvell Technology高级副总裁兼首席供应链官Vinay Krishna表示。
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© AT&S
PCB | September 24, 2026
Evertiq
Austrian IC substrate and PCB manufacturer AT&S has signed an expanded long-term agreement with semiconductor company Marvell Technology to supply advanced IC substrates for next-generation AI and cloud infrastructure.
Marvell Technology is the additional customer AT&S previously identified in connection with the expansion of its manufacturing site in Kulim, Malaysia. The expansion includes the fit-out of Plant 2 and the construction of a new facility for IC substrate cores and advanced packaging, according to a press release.
The deal reflects broader structural shifts in semiconductor design. The transition from monolithic chips to chiplet-based designs is increasing the need for advanced substrates across a wider range of applications — from custom AI accelerators to heterogeneous computing platforms. AT&S points to larger substrate formats, higher integration density and increased layer counts as key drivers.
"Marvell Technology is one of the semiconductor industry’s leading innovators in AI and data infrastructure, and together we are well positioned to capture the significant opportunities created by the global build-out of AI infrastructure," said Michael Mertin, CEO of AT&S.
The Kulim expansion is backed by long-term customer commitments, with Marvell Technology now confirmed as the customer AT&S previously identified in connection with the expansion.
"As our data centre business continues to expand, securing the manufacturing capacity and advanced technology capabilities required to support our customers remains a critical priority," said Vinay Krishna, Senior Vice President and Chief Supply Chain Officer at Marvell Technology.
From manufacturing and design to supply chains and emerging technologies, the electronics industry never stands still. Meet the people driving it forward at the upcoming Evertiq Expo events. The next stop is Evertiq Expo Warsaw on October 22, where industry professionals gather to exchange knowledge, discover new solutions and build valuable business connections.
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