韩美半导体赢得台湾晶圆代工厂大规模供应协议
韩美半导体进入台湾晶圆代工厂封装量产线供应链。据业内人士2日透露，韩美已获得一家台湾晶圆代工厂作为客户，为其提供封装设备。该协议涉及大规模供应，具体金额与型号未披露。此举将影响半导体封装设备市场供应格局。
原文深度解读
本文报道韩美半导体（Hanmi Semiconductor）首次进入台湾晶圆代工厂的封装量产线供应链，为其提供AI系统半导体封装（键合）设备。据业内人士2日透露，韩美已获得一家台湾晶圆代工厂客户，订单规模略低于披露门槛，估计为两位数台设备。韩美去年合并营收为5767亿韩元，KOSPI单笔销售/供应合同最低披露要求为营收的5%（约288亿韩元）。此次供应标志着韩美2.5D封装键合设备通过代工厂量产认证。文章还涉及韩美产品线、市场趋势及竞争格局，与电子元器件供应链中封装设备环节相关。
- 韩美半导体已进入台湾晶圆代工厂封装量产线供应链，首次有韩国封装设备（2.5D）通过台湾代工厂量产认证并部署。
- 合同对象和规模未披露，估计略低于披露门槛；韩美去年合并营收5767亿韩元，KOSPI最低披露要求为营收5%（约288亿韩元），订单量据报道为两位数。
- 韩美原专注于HBM键合设备，自去年起扩展产品组合至2.5D封装键合设备；此次供应表明其2.5D键合设备通过代工厂客户量产标准。
- 韩美拥有5种2.5D封装设备类型：2个倒装芯片（FC）键合机和3个热压（TC）键合机；FC Bonder 75（2025年9月发布）处理75mm中介层，FC Bonder 3.5（6月发布）处理340mm面板/基板；TC产品线以2.5D TC Bonder 40为主，分C2W和C2S配置，120mm级TC键合机目标年底发布。
- 封装设备需求预计稳步增长，因AI加速器需求上升导致主要代工厂封装产能紧张；台湾代工厂扩大内部产线，并将更多前端工艺外包给OSAT伙伴如ASE、SPIL、Amkor。
- 韩美计划年底前设立HanmiUSA；美国市场需求增长不仅来自HBM，还有Amkor后端扩张、代工相关封装及Intel EMIB计划。
供应链影响
- 韩美进入台湾代工厂供应链可能改变封装设备市场的竞争格局，但具体影响取决于其量产后的市场份额获取能力。
- 台湾代工厂将更多前端工艺外包给OSAT伙伴，可能扩大对键合设备的需求，韩美可能受益于这一趋势，但取决于其客户拓展进展。
- 韩美计划年底前设立HanmiUSA，可能影响美国市场封装设备供应，但取决于其在美国市场的认证和客户接受度。
- 韩美产品线覆盖不同尺寸和工艺，可能满足多样化客户需求，但市场接受度取决于实际量产表现。
- 现有企业主导市场，韩美需克服进入壁垒，其长期供应链地位可能取决于技术验证和客户关系。
系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。
韩美半导体在2026年台湾半导体展上的展位。〈照片=韩美半导体〉
韩美半导体已进入台湾晶圆代工厂封装量产线的供应链。
据业内人士2日透露，韩美已获得一家台湾晶圆代工厂作为客户，并开始为AI系统半导体供应封装（键合）设备。这是韩国封装设备（2.5D）首次通过台湾晶圆代工厂的量产认证（质量认证）并部署。
合同对象和规模未披露，估计略低于披露门槛。韩美去年合并营收为5767亿韩元，KOSPI单笔销售/供应合同的最低披露要求为营收的5%，约288亿韩元。据报道，订单量为两位数。
键合是封装中的关键工艺，决定芯片的附着位置和方式。韩美原本专注于HBM键合机（键合设备），自去年起扩展产品组合至2.5D封装键合机。此次供应表明韩美的2.5D封装键合机已通过代工厂客户的量产标准。
韩美的优势在于设备的多功能性。近期，客户要求的芯片尺寸和基板规格各异，单一设备型号难以满足所有需求。
韩美已确保5种2.5D封装设备类型，按面积和工艺分类：2个倒装芯片（FC）键合机和3个热压（TC）键合机。FC Bonder 75于2025年9月发布，处理大型75mm中介层；FC Bonder 3.5于6月推出，处理最大340mm的面板/基板。对于TC，产品线以用于芯片对晶圆工艺的2.5D TC Bonder 40为中心，配置分为芯片对晶圆（C2W）和芯片对基板（C2S）方法。针对更大中介层的120mm级TC键合机目标年底发布。
封装设备需求预计将稳步增长。这得益于AI加速器需求上升导致主要代工厂封装产能紧张。在台湾，代工厂扩大内部产线，同时将更多前端工艺（芯片对晶圆附着）外包给OSAT伙伴，如ASE、SPIL和Amkor。由于代工厂设定工艺和设备标准，而伙伴建立产线，键合设备需求正扩展到代工厂总部之外。
韩美正通过专注于客户拓展来顺应这一趋势。它计划年底前设立HanmiUSA。在美国，需求增长不仅来自HBM，还有Amkor的后端扩张、代工相关封装以及Intel的EMIB（嵌入式多芯片互连桥）计划。
量产后的市场份额获取仍是关键挑战。全球逻辑/倒装芯片键合机市场仍由ASMPT、Besi和K&S等现有企业主导。
一位设备行业内部人士指出：“虽然台湾晶圆代工生态系统因安全考虑对韩国设备持保守态度，但进入量产线意义重大。这是韩美从HBM设备转向系统封装设备公司的关键参考。”
Hanmi Semiconductor booth at Semicon Taiwan 2026. 〈Photo=Hanmi Semiconductor〉
Hanmi Semiconductor has entered the supply chain for Taiwan foundry companies' packaging mass production lines.
According to industry sources on the 2nd, Hanmi has secured a Taiwan foundry company as a customer and begun supplying packaging (bonding) equipment for AI system semiconductors. This marks the first time a South Korean packaging equipment (2.5D) has passed a Taiwan foundry's mass production qualification (quality certification) and been deployed.
The contract counterpart and scale remain undisclosed, estimated to be slightly below the disclosure threshold. Hanmi's consolidated revenue last year was 576.7 billion KRW, with the minimum disclosure requirement for single sales/supply contracts on KOSPI being 5% of revenue, approximately 28.8 billion KRW. The order volume is reported to be in double digits.
Bonding is a critical process in packaging that determines where and how chips are attached. Originally specializing in HBM bonders (bonding equipment), Hanmi has expanded its product portfolio to include 2.5D packaging bonders since last year. This supply signifies that Hanmi's 2.5D packaging bonder has passed the mass production standards of a foundry customer.
Hanmi's strength lies in equipment versatility. Recently, varying die sizes and substrate specifications demanded by customers make it difficult for a single equipment model to meet all needs.
Hanmi has secured five 2.5D packaging equipment types, categorized by area and process: two flip-chip (FC) bonders and three thermocompression (TC) bonders. The FC Bonder 75, released in September 2025, handles large 75mm interposers, while the FC Bonder 3.5, launched in June, processes panels/substrates up to 340mm. For TC, the lineup centers on the 2.5D TC Bonder 40 for chip-on-wafer processes, with configurations split for chip-to-wafer (C2W) and chip-to-substrate (C2S) methods. A 120mm-class TC bonder for larger interposers is targeted for year-end release.
Demand for packaging equipment is expected to grow steadily. This is driven by strained packaging capacities at major foundries due to rising AI accelerator demand. In Taiwan, foundries are expanding in-house lines while outsourcing more front-end processes (chip-to-wafer attachment) to OSAT partners like ASE, SPIL, and Amkor. Since foundries set process and equipment standards while partners build lines, bonding equipment demand is expanding beyond foundry headquarters.
Hanmi is aligning with this trend by focusing on customer expansion. It is pushing to establish HanmiUSA by year-end. In the U.S., demand is growing not only for HBM but also for Amkor's back-end expansions, foundry-linked packaging, and Intel's EMIB (Embedded Multi-die Interconnect Bridge) initiatives.
Securing market share post-mass production remains a key challenge. The global logic/flip-chip bonder market is still dominated by incumbents like ASMPT, Besi, and Kulicke & Soffa (K&S).
An equipment industry insider noted, “While Taiwan's foundry ecosystem is conservative toward Korean equipment due to security concerns, breaking into mass production lines is significant. It's a critical reference for Hanmi's shift from HBM equipment to a system packaging equipment company.”