LB半导体向高通交付首批产品
LB半导体于9月2日举行仪式，庆祝向高通交付首批产品，这是该外包半导体封测（OSAT）公司的首次交付。
原文深度解读
本文报道了韩国外包半导体封测（OSAT）公司LB Semicon于2024年9月2日宣布，已向高通交付首批产品，并于8月31日在平泽总部举行纪念仪式。此次合作始于2024年下半年，经过技术审查、质量体系审核等流程后，于8月初开始量产。LB Semicon为高通的电源管理IC（PMIC）提供后端处理服务，应用于AI数据中心和汽车领域。文章还提及双方讨论中长期合作，LB Semicon计划扩大产能并获取新认证，同时公司正通过增发股票融资投资新设备。该事件标志着LB Semicon业务多元化，从显示驱动IC扩展到系统半导体和功率半导体，并成为瑞萨的后端供应商。
- LB Semicon于9月2日宣布，8月31日在平泽总部举行仪式，纪念向高通交付首批产品，这是该公司首次向高通交付。
- 合作始于2024年下半年，LB Semicon通过了高通的技术审查、QMS审核、可靠性认证和最终检查，并于8月初开始量产，8月底首批产品出货。
- LB Semicon为高通的PMIC提供后端处理，包括凸点、测试和封装，这些PMIC用于AI数据中心和汽车应用。
- LB Semicon使用铜柱凸点（CPB）和晶圆级封装（WLP）技术生产高通产品，拥有40微米间距的CPB技术。
- 双方讨论了中长期合作，LB Semicon计划随着高通产量增加逐步扩大产能，并获取新工艺或产品的额外认证。
- LB Semicon正在投资新的凸点和后端设备，利用增发股票筹集的资金，预计从明年下半年起产量增长将加速。
供应链影响
- LB Semicon成为高通PMIC后端供应商，可能增强高通在AI数据中心和汽车领域的供应链多元化，但具体影响取决于后续产量和认证进展。
- LB Semicon的产能扩张计划可能影响其承接更多高通订单的能力，但取决于市场需求和资金到位情况。
- LB Semicon获得汽车半导体认证，可能使其在汽车供应链中的地位提升，但取决于其能否持续满足质量要求。
- LB Semicon与瑞萨的合作可能扩大其功率半导体后端业务，但具体影响取决于合作深度和订单量。
- LB Semicon从显示驱动IC向系统半导体和功率半导体转型，可能改变其供应链结构，但取决于新业务的市场表现。
系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。
LB Semicon举行仪式，纪念向高通交付首批产品。（图片来源：LB Semicon）
LB Semicon于9月2日表示，已举行仪式，纪念向高通交付首批产品，这是该外包半导体封测（OSAT）公司的首次交付。
仪式于8月31日在LB Semicon位于平泽的总部举行。包括LB Semicon首席执行官Lee Dae-kyo和高通官员在内的高管出席了仪式。双方分享了合作进展和成就，以及LB Semicon后端技术和生产能力的现状。
LB Semicon为高通的电源管理集成电路（PMIC）提供后端处理，包括凸点、测试和后端操作，这些PMIC用于人工智能（AI）数据中心和汽车应用。该公司提供交钥匙服务，在半导体电路制造完成后处理器件晶圆。
凸点是在半导体芯片表面形成金属突起或凸点。凸点将芯片与基板电连接。测试检查芯片的电特性。后端处理包括将晶圆切割成单个芯片，并进行加工和封装以保护它们免受外部冲击。
两年合作后开始量产
两家公司之间的合作始于2024年下半年。LB Semicon在量产前通过了高通的技术审查、质量管理体系（QMS）审核、可靠性认证和最终检查。这一过程为其拓展汽车半导体业务奠定了基础。
在此过程中，LB Semicon运营了一个专门组织，涉及工程、采购、生产计划和测试。它还在短时间内为高通建立了专用生产线。量产于8月初开始，首批产品于月底出货。
LB Semicon正在使用其铜柱凸点（CPB）量产能力和晶圆级封装（WLP）技术生产高通产品。
CPB是一种使用铜形成柱状导电凸点的技术。它适用于凸点间距更窄的细间距结构，以及高性能、高速信号传输和互连技术。LB Semicon拥有40微米间距的CPB技术。
WLP是一种在前端处理完成后，在晶圆形式下进行封装和测试的工艺技术。与单个芯片封装相比，它可以将封装尺寸减小到大约芯片大小，并缩短电传输路径。这使其适用于高性能、低功耗半导体。
公司讨论中长期合作
两家公司还讨论了相互期望以及中长期合作的方向。LB Semicon计划随着高通产量的增加逐步扩大产能，并获得新工艺或产品的额外认证。
双方还同意共同运营一个系统，用于主动风险应对、持续良率和工艺改进，以及定期审查合作。目标是确保产品稳定供应。
LB Semicon目前正在投资新的凸点和后端设备。该公司正在提前扩大产能，以应对预计从明年下半年开始加速的产量增长。它正在使用通过增发股票筹集的资金。
“存在各种技术和运营挑战，但在高通的支持和信任下满足高标准的过程本身就是增长的重大机遇，”Lee表示。“我们将通过稳定的质量和交付建立信任，同时通过产能扩张和额外认证逐步扩大合作范围。”
LB Semicon正在从现有的显示驱动IC（DDI）业务多元化，进入系统半导体和功率半导体领域。它最近还加入了瑞萨，作为功率半导体的后端处理供应商。
LB Semicon held a ceremony to mark the shipment of its first products for Qualcomm. (Photo: LB Semicon)
LB Semicon said on Sept. 2 it held a ceremony to mark the shipment of its first products for Qualcomm, the first such delivery by the outsourced semiconductor assembly and test (OSAT) company.
The ceremony was held Aug. 31 at LB Semicon's headquarters in Pyeongtaek. Executives including LB Semicon CEO Lee Dae-kyo and Qualcomm officials attended. The companies shared progress and achievements in their cooperation as well as the status of LB Semicon's back-end technology and production capabilities.
LB Semicon handles back-end processing, including bumping, testing and backend operations, for Qualcomm's power management integrated circuits (PMICs) used in artificial intelligence (AI) data centers and automotive applications. The company provides a turnkey service that processes device wafers after semiconductor circuit fabrication is completed.
Bumping forms metal protrusions, or bumps, on the surface of semiconductor chips. The bumps electrically connect chips to substrates. Testing examines the electrical characteristics of chips. Backend processing involves cutting wafers into individual chips and processing and packaging them to protect them from external impacts.
Mass Production Begins After Two Years of Cooperation
Cooperation between the two companies began in the second half of 2024. LB Semicon passed Qualcomm's technology review, quality management system (QMS) audit, reliability qualification and final checks before mass production. The process laid the foundation for expanding its business into automotive semiconductors.
During the process, LB Semicon operated a dedicated organization involving engineering, sourcing, production planning and testing. It also built a dedicated production line for Qualcomm within a short period. Mass production began in early August, with the first products shipped at the end of the month.
LB Semicon is producing Qualcomm products using its copper pillar bump (CPB) mass-production capabilities and wafer-level packaging (WLP) technology.
CPB is a technology that forms pillar-shaped conductive bumps using copper. It is suited for fine-pitch structures with narrower spacing between bumps, as well as high-performance, high-speed signal transmission and interconnection technologies. LB Semicon has 40-micrometer-pitch CPB technology.
WLP is a process technology that performs packaging and testing while semiconductors remain in wafer form after front-end processing. Compared with individual die packaging, it can reduce package size to roughly the size of the chip and shorten electrical transmission paths. This makes it suitable for high-performance, low-power semiconductors.
Companies Discuss Mid- to Long-Term Cooperation
The two companies also discussed mutual expectations and the direction of their mid- to long-term cooperation. LB Semicon plans to gradually expand production capacity as Qualcomm volumes increase and obtain additional certifications for new processes or products.
The companies also agreed to jointly operate a system for proactive risk response, continuous yield and process improvements, and regular reviews of their cooperation. The goal is to ensure a stable supply of products.
LB Semicon is currently investing in new bumping and backend equipment. The company is expanding capacity in advance of an increase in volume expected to accelerate from the second half of next year. It is using funds raised through a rights offering.
"There were various technical and operational challenges, but the process of meeting high standards with Qualcomm's support and trust was itself a major opportunity for growth," Lee said. "We will build trust through stable quality and delivery while gradually expanding the scope of our cooperation through capacity expansion and additional certifications."
LB Semicon is diversifying its business into system semiconductors and power semiconductors from its existing focus on display driver ICs (DDIs). It has also recently joined Renesas as a back-end processing supplier for power semiconductors.