LX Semicon将退出SiC业务，出售逾60项专利
LX Semicon正在出售其碳化硅（SiC）功率半导体相关专利，这标志着其退出SiC业务的最后阶段。据业内消息人士10月13日透露，LX Semicon此次挂牌出售的SiC相关专利超过60项。该公司此前已决定退出SiC功率半导体领域，专利出售是该退出进程的收尾环节，涉及功率半导体器件相关知识产权。
原文深度解读
本文报道LX Semicon正在出售其碳化硅（SiC）功率半导体相关专利，涉及超过60项专利，涵盖SiC器件和外延晶圆，标志着其退出SiC业务的最后阶段。文章涉及LX Semicon、LG Innotek、Sanken Electric、Novatek等主体，时间线从2021年进入SiC业务到2025年专利出售，关键数字包括专利数量超60项、打包售价预计低于10亿韩元、专利期限最长至2045年、营收连续三年下降等。与电子元器件供应链的关系在于：SiC功率半导体是电动汽车等应用的关键器件，LX Semicon退出该领域并出售专利，可能影响SiC器件及相关外延晶圆的知识产权布局和供应格局。
- LX Semicon于2021年通过收购LG Innotek的器件制造设备和专利进入SiC业务，时任CEO Son Bo-ik推动此举以多元化严重依赖显示驱动IC（DDI）的业务组合。
- 2023年底Lee Yun-tae接任CEO后公司战略转变，因电动汽车需求停滞导致SiC市场增长放缓，LX Semicon于2024年缩减SiC研发组织规模。
- LX Semicon已挂牌出售超过60项SiC器件和外延晶圆专利，采用打包捆绑方式而非单独出售，整个专利组合预计售价低于10亿韩元；专利在韩国、美国、中国、欧洲、日本和台湾申请，期限最长至2045年；一家国内功率半导体公司已被选为优先谈判伙伴。
- 器件专利涵盖SiC MOSFET技术，包括平面和沟槽栅结构、终端和栅极焊盘；外延晶圆专利也包括在内，外延晶圆是在SiC晶圆上生长薄晶体层并在该层制造半导体器件。
- LX Semicon在2024年4月开始量产散热基板，其MCU最初供应家电，最近已交付现代汽车和起亚，并据报道正与韩华讨论供应安排；与日本Sanken Electric成立的功率器件合资企业（Advanced Power Device Technology）已于今年上半年清算。
- 公司营收连续三年下降：2022年2.1193万亿韩元、2023年1.9014万亿韩元、2024年1.8656万亿韩元、2025年1.6391万亿韩元；今年上半年营收同比下降7.6%至7899亿韩元，营业利润下降39%至426亿韩元；DDI仍占总营收86%以上；此外，据行业消息人士称，LX Semicon在将主要客户的DDI订单输给台湾Novatek后面临挑战。
供应链影响
- LX Semicon退出SiC业务并出售专利，可能减少SiC功率半导体领域的一个知识产权来源，但具体影响取决于专利买家的整合和运用方式。
- 专利打包出售给国内功率半导体公司，可能使相关SiC器件和外延晶圆技术集中到少数主体手中，从而可能影响该领域的竞争格局和供应链话语权。
- LX Semicon缩减SiC研发并清算与Sanken Electric的合资企业，可能意味着其逐步退出SiC功率器件供应，但实际供应变化取决于其剩余业务安排和市场需求。
- 公司营收持续下降且DDI订单流失，可能削弱其在电子元器件供应链中的整体地位，但对其SiC相关客户和合作伙伴的具体影响取决于后续业务调整。
- LX Semicon转向散热基板、MCU等新业务并拓展汽车客户，可能使其在供应链中的角色从SiC功率器件转向其他元器件，但成效仍取决于市场接受度和客户订单。
系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。
(照片：LX Semicon)
LX Semicon正在出售其与碳化硅（SiC）功率半导体相关的专利，这标志着其退出SiC业务的最后阶段。
据行业消息人士10月13日透露，LX Semicon已将超过60项涵盖SiC器件和外延晶圆的专利挂牌出售。该公司并非单独出售这些专利，而是以打包捆绑的方式提供。整个专利组合预计售价低于10亿韩元。
器件专利涵盖SiC金属氧化物半导体场效应晶体管（MOSFET）技术，包括平面和沟槽栅结构、终端和栅极焊盘。与外延晶圆相关的专利也包括在内。外延晶圆是通过在SiC晶圆上生长薄晶体层而制成的，半导体器件在该层中制造。这些专利在韩国、美国、中国、欧洲、日本和台湾申请，专利期限最长至2045年。一家国内功率半导体公司已被选为优先谈判伙伴。
LX Semicon于2021年通过从LG Innotek收购器件制造设备和专利进入SiC业务。时任首席执行官Son Bo-ik启动了此举，以多元化公司严重依赖显示驱动IC（DDI）的业务组合。
然而，在Lee Yun-tae于2023年底接任CEO后，公司战略发生转变。由于电动汽车需求停滞，SiC市场增长放缓。LX Semicon随后于2024年缩减了其SiC研发组织的规模。
在3月的年度股东大会上，LX Semicon将技术、专有技术和知识产权的转让、让与和许可及相关业务加入其列明的业务目标。一位公司官员当时表示，这一变化旨在精简其运营。
LX Semicon已开展多种新业务以减少对DDI的依赖，结果喜忧参半。它于2024年4月开始量产散热基板。据消息人士称，其最初供应家电的微控制器单元（MCU）最近已交付现代汽车和起亚。该公司还据报道正与韩华讨论供应安排。SiC业务目前正通过专利出售逐步结束。与日本Sanken Electric成立的功率器件合资企业（Advanced Power Device Technology）也已于今年上半年清算。
公司营收持续下降。年度销售额连续三年下降，从2022年的2.1193万亿韩元降至2023年的1.9014万亿韩元、2024年的1.8656万亿韩元，以及2025年的1.6391万亿韩元。今年上半年营收同比下降7.6%至7899亿韩元，而营业利润下降39%至426亿韩元。DDI仍占总营收的86%以上。
据行业消息人士称，LX Semicon在将主要客户的DDI订单输给台湾Novatek后也面临挑战。
(Photo: LX Semicon)
LX Semicon is selling its patents related to silicon carbide (SiC) power semiconductors, marking the final stage of its exit from the SiC business.
According to industry sources on Oct. 13, LX Semicon has put more than 60 patents covering SiC devices and epitaxial wafers up for sale. Rather than selling them individually, the company is offering the patents in package bundles. The entire portfolio is expected to fetch less than 1 billion won.
The device patents cover SiC metal-oxide-semiconductor field-effect transistor (MOSFET) technologies, including planar and trench gate structures, termination, and gate pads. Patents related to epitaxial wafers are also included. An epitaxial wafer is produced by growing a thin crystalline layer on a SiC wafer, with semiconductor devices fabricated in that layer. The patents were filed in South Korea, the U.S., China, Europe, Japan, and Taiwan, with patent terms extending until up to 2045. A domestic power semiconductor company has been selected as the preferred negotiating partner.
LX Semicon entered the SiC business in 2021 by acquiring device manufacturing equipment and patents from LG Innotek. Then-Chief Executive Officer Son Bo-ik initiated the move to diversify the company's business portfolio, which was heavily reliant on display driver integrated circuits (DDIs).
However, the company's strategy shifted after Lee Yun-tae took over as CEO in late 2023. Growth in the SiC market slowed amid stagnating electric vehicle demand. LX Semicon subsequently reduced the size of its SiC research and development organization in 2024.
At its annual general meeting in March, LX Semicon added the transfer, assignment, and licensing of technology, know-how, and intellectual property, along with related businesses, to its stated business objectives. A company official said at the time that the change was intended to streamline its operations.
LX Semicon has pursued various new businesses to reduce its reliance on DDIs, with mixed results. It began mass production of heat-dissipation substrates in April 2024. Its microcontroller units (MCUs), initially supplied for home appliances, have more recently been delivered to Hyundai Motor and Kia, according to sources. The company is also reported to be discussing supply arrangements with Hanwha. The SiC business is now being wound down through the patent sale. A power device joint venture established with Japan's Sanken Electric (Advanced Power Device Technology) was also liquidated in the first half of this year.
The company's revenue has continued to decline. Annual sales fell for three consecutive years, from 2.1193 trillion won in 2022 to 1.9014 trillion won in 2023, 1.8656 trillion won in 2024, and 1.6391 trillion won in 2025. Revenue for the first half of this year dropped 7.6% from a year earlier to 789.9 billion won, while operating profit fell 39% to 42.6 billion won. DDIs still account for over 86% of total revenue.
LX Semicon is also facing challenges after losing DDI orders for major customers to Taiwan's Novatek, according to industry sources.