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TrendForce Press Center原文发布 07-30 16:04Radar 收录 08-01 12:15

TrendForce:2027年内存市场展望分化,DRAM供应持续紧张而NAND闪存供应宽松

Diverging Memory Market Outlook in 2027 as DRAM Supply Remains Tight While NAND Flash Supply Conditions Ease, Says TrendForce
中文摘要

TrendForce最新研究显示,AI仍将是2027年内存需求的主要驱动力。市场动态预计在DRAM和NAND Flash之间出现分化:DRAM供应保持紧张,而NAND Flash供应条件趋于宽松。

原文深度解读

TrendForce最新研究显示,AI仍将是2027年内存需求的主要驱动力。市场动态预计在DRAM和NAND Flash之间出现分化:DRAM供应保持紧张,而NAND Flash供应条件趋于宽松。文章涉及TrendForce、DRAM、NAND Flash、HBM、AI服务器、CSP等主体,时间聚焦2026-2027年,关键数字包括2026年服务器出货量同比增长17%、DRAM供需比约-1%至-2%等。与电子元器件供应链的关系:内存芯片是电子元器件核心,其供需变化直接影响价格、产能分配和下游设备成本。

  • TrendForce预测2027年AI仍是内存需求主要驱动力,但DRAM和NAND Flash市场动态将分化。
  • DRAM供应紧张原因:HBM产能分配、AI服务器需求强劲、CPU内存和HBM采购增加;NAND Flash供应宽松原因:新产能上线、消费电子需求疲软。
  • DRAM供应商已启动扩产计划,但新产能要到2027年下半年才能有效爬坡,2028年才有实质产出贡献。
  • HBM制造比传统DRAM消耗更多晶圆,因此晶圆投入增加不按比例转化为位元产出。
  • TrendForce预测2027年全球服务器出货量增速将高于2026年的17%同比;消费电子(智能手机、笔记本)出货量预计2027年继续下滑。
  • TrendForce估计2026年DRAM供需比约-1%至-2%,2027年供需缺口将进一步扩大;NAND Flash供需比预计在2027年转正,市场从供应紧张转向平衡。

供应链影响

  • DRAM供应紧张可能持续至2027年,导致DRAM价格维持高位,下游服务器和消费电子成本可能上升。
  • NAND Flash供应宽松可能使价格承压,企业级SSD和消费级存储产品价格可能下降,但取决于需求吸收情况。
  • HBM产能分配可能挤压传统DRAM产能,影响标准DRAM的供应,进而影响PC和移动设备市场。
  • CSP资本支出持续高位,若内存价格高企,可能影响其后续投资计划,进而影响内存采购量。
  • NAND Flash新产能爬坡和QLC SSD需求增长可能改变企业存储市场格局,但Agentic AI的突破可能增加高速SSD需求,吸收增量供应。

系统解读,仅作为判断线索,不构成备货、出货、涨价或投资建议。

正文内容 · AI翻译

TrendForce最新研究显示,AI仍将是2027年内存需求的主要驱动力。然而,市场动态预计在DRAM和NAND Flash之间出现分化。

在DRAM方面,持续的HBM产能分配、强劲的AI服务器需求以及CPU内存和HBM采购的增加,预计将使供应保持紧张,价格呈上升趋势。相比之下,NAND Flash预计将在2027年下半年进入更宽松的供应环境,因为新产能上线而消费电子需求依然疲软,增加了价格下行压力。

DRAM供应增长预计将落后于需求扩张

TrendForce指出,主要DRAM供应商已启动扩产计划,以应对由AI基础设施投资驱动的中长期需求。短期内,制造商正在扩大现有晶圆厂的产出,加速工艺迁移,并减少产品转换频率,以在2026年全年最大化位元产出增长。

尽管多家供应商计划在2027年上线新产能,但建设进度、设备安装和原材料准备将把实质性产能爬坡推迟到2027年下半年。鉴于半导体制造周期,预计到2028年才能实现可观的产出贡献。

此外,HBM制造比传统DRAM需要显著更多的晶圆投入,这意味着更高的晶圆启动量不会按比例转化为额外的位元产出。这些因素将限制2027年DRAM整体位元供应增长,使市场供应保持紧张。

从需求角度看,北美CSP的持续资本支出、英特尔和AMD下一代CPU平台的出货,以及Agentic AI的商业化,预计将推动更强劲的服务器需求。TrendForce预测,2027年全球服务器出货量增速将快于2026年记录的17%同比。

与此同时,每台AI服务器的HBM容量增加以及SOCAMM等新内存标准的采用,将显著提高每台服务器的内存含量,支持DRAM位元需求再次强劲增长。

相比之下,包括智能手机和笔记本在内的消费电子产品预计将继续面临压力。更高的组件成本正越来越多地通过更高的零售价格转嫁给消费者,抑制了换机需求,导致2027年出货量再次下滑。

TrendForce估计2026年DRAM供需比约为-1%至-2%。此外,随着需求增长继续超过供应扩张,2027年供需缺口预计将进一步扩大。

然而,该公司指出,CSP的资本支出在2026年全年保持创纪录水平,一些供应商甚至报告负自由现金流。如果内存价格在2027年全年保持高位,内存将占CSP基础设施支出的更大份额。这是否最终影响CSP的投资计划和内存采购,仍是一个值得关注的关键变量。

NAND Flash产能扩张将改变市场平衡

2026年,NAND Flash供应商主要通过工艺技术迁移而非大规模产能扩张来增加位元产出。在AI服务器和高容量企业级SSD强劲需求的支持下,供应商继续优先生产企业级SSD,以抵消消费市场较弱的盈利能力。

展望2027年,向更高层数NAND产品的加速迁移以及新晶圆厂的逐步爬坡,预计将推动比2026年显著更强的位元供应增长,导致行业产出大幅扩张。

企业存储仍将是需求侧的主要增长引擎。强劲的服务器部署将继续支持CSP和企业客户采购高性能、高容量企业级SSD,其中QLC SSD预计将占NAND增量需求的最大份额。另一方面,消费电子需求预计将保持低迷,因为更高的设备价格继续抑制购买活动。

TrendForce预计,随着新产能逐步投产而消费需求依然疲软,NAND Flash市场将在2027年发生结构性转变。该公司此前预测,NAND Flash供需比将在2027年转正,表明市场将从供应受限的环境过渡到更平衡的市场。

尽管如此,TrendForce指出,Agentic AI采用的突破可能显著增加对高速SSD的需求,有助于吸收增量供应,使整体市场更接近平衡。

TrendForce’s latest research on the memory industry reveals that AI will remain the primary driver of memory demand in 2027. However, market dynamics are expected to diverge between DRAM and NAND Flash.

On the DRAM side, continued HBM capacity allocation, robust AI server demand, and growing procurement of CPU memory and HBM are expected to keep supply constrained and prices on an upward trajectory. By contrast, NAND Flash is projected to enter a looser supply environment in 2H27 as new production capacity comes online while consumer electronics demand remains weak, increasing downward pressure on prices.

DRAM supply growth expected to lag behind demand expansion

TrendForce notes that major DRAM suppliers have already initiated expansion plans to address medium- to long-term demand driven by investments in AI infrastructure. In the near term, manufacturers are expanding output from existing fabs, accelerating process migrations, and reducing product conversion frequency to maximize bit output growth throughout 2026.

Although several suppliers plan to bring new capacity online in 2027, construction schedules, equipment installation, and raw material preparation will delay meaningful production ramp-ups until the second half of 2027. Given the semiconductor manufacturing cycle, substantial output contributions are not expected to materialize until 2028.

Additionally, HBM manufacturing requires significantly more wafer input than conventional DRAM, meaning that higher wafer starts do not translate proportionally into additional bit output. These factors will constrain overall DRAM bit supply growth in 2027, keeping market supply tight.

From a demand perspective, continued capital expenditure by North American CSPs, shipments of next-generation CPU platforms from Intel and AMD, and the commercialization of Agentic AI are expected to drive stronger server demand. TrendForce forecasts global server shipments to grow faster in 2027 than the 17% YoY recorded in 2026.

Meanwhile, increasing HBM capacity per AI server and the adoption of new memory standards such as SOCAMM will significantly increase memory content per server, supporting another year of robust DRAM bit demand growth.

In contrast, consumer electronics, including smartphones and notebooks, are expected to remain under pressure. Higher component costs are increasingly being passed on to consumers through higher retail prices, dampening replacement demand and leading to another year of declining shipments in 2027.

TrendForce estimates the DRAM sufficiency ratio at approximately -1% to -2% in 2026. Furthermore, the supply-demand gap is expected to widen further in 2027 as demand growth continues to outpace supply expansion.

However, the firm notes that CSPs’ capital expenditure remained at record levels throughout 2026, with some providers even reporting negative free cash flow. If memory prices remain elevated throughout 2027, memory will account for a larger share of CSP infrastructure spending. Whether this ultimately affects CSP investment plans and memory procurement remains a key variable to watch.

NAND Flash capacity expansion to shift market balance

In 2026, NAND Flash suppliers primarily increased bit output through process technology migration rather than major capacity expansion. Supported by strong demand for AI servers and high-capacity enterprise SSDs, suppliers continued prioritizing enterprise SSD production to offset weaker profitability in consumer markets.

Looking ahead to 2027, accelerated migration to higher-layer NAND products and the gradual ramp-up of new fabs are expected to drive significantly stronger bit supply growth than in 2026, resulting in a substantial expansion of industry output.

Enterprise storage will remain the primary growth engine on the demand side. Robust server deployments will continue to support procurement of high-performance, high-capacity enterprise SSDs by CSPs and enterprise customers, with QLC SSDs expected to account for the largest share of incremental NAND demand. Consumer electronics demand, on the other hand, is expected to remain subdued as higher device prices continue to suppress purchasing activity.

TrendForce expects the NAND Flash market to undergo a structural shift in 2027 as new capacity gradually enters production while consumer demand remains weak. The firm previously forecast that the NAND Flash sufficiency ratio will turn positive in 2027, indicating that the market will transition from a supply-constrained environment to a more balanced market.

Nevertheless, TrendForce notes that a breakthrough in the adoption of Agentic AI could significantly increase demand for high-speed SSDs, helping absorb incremental supply and bringing the overall market closer to equilibrium.