高通推出 Dragonwing Q-2390 和 IQ-2390 处理器
高通于9月1日发布新款Dragonwing Q-2390和IQ-2390处理器，旨在降低成本和尺寸。Dragonwing是高通面向工业和嵌入式领域的B2B平台。
原文深度解读
高通于9月1日发布新款Dragonwing Q-2390和IQ-2390处理器，旨在降低成本和尺寸。Dragonwing是高通面向工业和嵌入式领域的B2B平台。文章涉及高通、Eight Development、Fibocom、SECO和Engicam等公司，时间节点包括2026年9月1日发布、IFA 2026展会（9月4-8日）、2027年初评估套件可用。关键数字包括四核CPU、Adreno 704 GPU、RISC-V MCU、LTE Cat 4、双千兆以太网、工作温度-30°C至115°C。与电子元器件供应链相关，涉及处理器、SOM、单板计算机等元器件的开发与供应。
- 高通于9月1日发布Dragonwing Q-2390和IQ-2390处理器，设计目标是降低成本和尺寸。
- Dragonwing是高通的B2B平台，面向工业、嵌入式物联网、网络和蜂窝基础设施解决方案。
- 两款处理器均集成四核Kryo CPU、Adreno 704 GPU和基于RISC-V的MCU，支持Linux、Android和Zephyr OS。
- Q-2390属于Q2系列，面向边缘产品，集成设备端AI、摄像头、显示、LTE Cat 4、GPS、多种连接和I/O端口。
- IQ-2390是IQ2系列首款工业边缘AI产品，补充现有IQ10、IQX、IQ9、IQ8和IQ6系列，支持双千兆以太网和TSN，工作温度-30°C至115°C。
- 两款处理器目前通过早期访问计划提供给关键客户和合作伙伴，评估套件计划2027年初可用。
供应链影响
- 新处理器的发布可能推动相关元器件（如SOM、单板计算机、通信模块）的需求增长，取决于合作伙伴产品的市场接受度。
- 早期访问计划可能影响首批产品的供应节奏，评估套件在2027年初的可用性可能影响开发周期。
- IQ-2390的工业级特性（如宽温、抗振）可能使其在工业自动化、能源等领域的采用增加，进而影响相关供应链。
- 支持多种OS和连接选项可能扩大设备制造商的采购选择，可能影响对特定元器件的需求。
- 合作伙伴开发的产品（如Fibocom的模块、SECO的SBC）可能成为供应链中的新组件，其量产时间取决于开发进度。
系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。
高通于9月1日发布新款Dragonwing Q-2390和IQ-2390处理器，旨在降低成本和尺寸。（图片来源：高通）
高通于9月1日发布新款Dragonwing Q-2390和IQ-2390处理器，旨在降低成本和尺寸。
高通Dragonwing是一个面向工业和嵌入式物联网（IoT）、网络和蜂窝基础设施解决方案的企业对企业（B2B）平台。新处理器专为消费、商业和工业市场的智能连接设备设计，将人工智能（AI）、视觉处理、连接性和安全性集成到处理器中。
高通计划在IFA 2026展会上展示由这两款处理器驱动的系统级模块（SOM）。该展会将于9月4日至8日在柏林举行。
两款产品目前通过早期访问计划（EAP）提供给关键客户和合作伙伴。用于性能测试的评估套件计划于2027年初推出。
两款处理器均配备四核高通Kryo中央处理器（CPU）、高通Adreno 704图形处理器（GPU）和基于RISC-V的微控制器单元（MCU）。它们支持Linux、Android和Zephyr OS，为制造商和开发者在产品开发中提供更大灵活性。
Dragonwing Q-2390是Q2系列的最新款产品。它专为成本、功耗和尺寸受限的边缘产品设计。该平台在单一平台上集成了设备端AI、摄像头和显示支持、长期演进（LTE）Cat 4连接、全球定位系统（GPS）功能、各种有线和无线连接选项以及输入/输出端口。
它可用于零售销售点（POS）系统、自助服务终端、门禁设备、智能家电、智能农业设备、家用机器人、健身器材和企业终端。设备制造商可以降低系统复杂性和开发成本。
Dragonwing 2390系列可用于开发家庭、商业和工业应用的设备。（图片来源：高通）
Dragonwing IQ-2390是IQ2系列工业边缘AI产品的首款型号。它补充了高通现有的工业IQ10、IQX、IQ9、IQ8和IQ6系列。该处理器旨在为工业自动化、石油和天然气、公用事业和能源应用中的紧凑型边缘设备提供高可靠性、实时响应和长产品生命周期。
IQ-2390结合了应用处理、机器视觉、AI加速和双千兆（Gb）以太网与时间敏感网络（TSN）。机器视觉使机器和计算机能够分析摄像头捕获的视觉信息。TSN是一种旨在在指定时间约束内可靠传输数据的技术。
该处理器还设计用于恶劣工业环境中的耐用性，工作温度范围为-30摄氏度至115摄氏度。其抗振动和冲击能力使其适用于工厂、能源设施和户外工业场所。它还降低了物料清单（BoM）成本、板卡空间和系统集成复杂性。
IQ-2390可用于人机界面（HMI）、可编程逻辑控制器（PLC）、网关、工业视觉系统、楼宇自动化和能源管理系统。PLC是一种工业控制计算机，通过HMI精确控制机械部件和传感器。
“借助Dragonwing Q-2390和IQ-2390处理器，我们正在将智能扩展到更广泛的设备范围，从零售系统、智能家电和消费机器人到工业控制器、机器视觉系统和关键基础设施，”高通副总裁Jeff Arnold表示。“这些平台共同帮助将先进的边缘AI带给比以往更多的客户和行业。”
行业合作伙伴也已开始基于这些处理器开发产品。Eight Development正在准备一个可扩展的基于Q-2390的平台，用于安全、消防、生命安全与楼宇自动化产品。可扩展平台在多个产品中使用通用处理器架构和标准化软件规范。
Fibocom也在开发基于Q-2390的智能无线通信模块，用于POS系统和工业手持设备。SECO和Engicam正在开发基于IQ-2390的产品。SECO正在开发单板计算机（SBC）和HMI，而Engicam正在开发SOM。
Qualcomm unveiled the new Dragonwing Q-2390 and IQ-2390 processors on Sept. 1, designed to reduce cost and size. (Photo: Qualcomm)
Qualcomm on Sept. 1 unveiled its new Dragonwing Q-2390 and IQ-2390 processors, designed to reduce cost and size.
Qualcomm Dragonwing is a business-to-business (B2B) platform for industrial and embedded Internet of Things (IoT), networking and cellular infrastructure solutions. The new processors are designed for intelligent connected devices across consumer, commercial and industrial markets, integrating artificial intelligence (AI), vision processing, connectivity and security into the processors.
Qualcomm plans to showcase system-on-modules (SOMs) powered by both processors at its booth at IFA 2026. The exhibition runs from Sept. 4 to 8 in Berlin.
Both products are currently available to key customers and partners through an Early Access Program (EAP). Evaluation kits for performance testing are scheduled to become available in early 2027.
Both processors feature a quad-core Qualcomm Kryo central processing unit (CPU), Qualcomm Adreno 704 graphics processing unit (GPU) and a RISC-V-based microcontroller unit (MCU). They support Linux, Android and Zephyr OS, giving manufacturers and developers greater flexibility in product development.
The Dragonwing Q-2390 is the latest product in the Q2 Series. It is designed for edge products with tight cost, power and size constraints. The platform combines on-device AI, camera and display support, Long-Term Evolution (LTE) Cat 4 connectivity, Global Positioning System (GPS) capabilities, various wired and wireless connectivity options and input/output ports on a single platform.
It can be used in retail point-of-sale (POS) systems, kiosks, access-control devices, smart appliances, smart agriculture devices, home robots, fitness equipment and enterprise terminals. Device manufacturers can reduce system complexity and development costs.
The Dragonwing 2390 Series can be used to develop devices for home, commercial and industrial applications. (Photo: Qualcomm)
The Dragonwing IQ-2390 is the first model in the IQ2 Series of industrial edge AI products. It complements Qualcomm's existing industrial IQ10, IQX, IQ9, IQ8 and IQ6 series. The processor is designed to provide high reliability, real-time responsiveness and long product lifecycles for compact edge equipment used in industrial automation, oil and gas, utilities and energy applications.
The IQ-2390 combines application processing, machine vision, AI acceleration and dual Gigabit (Gb) Ethernet with Time-Sensitive Networking (TSN). Machine vision enables machines and computers to analyze visual information captured by cameras. TSN is a technology designed to transmit data reliably within specified time constraints.
The processor is also designed for durability in harsh industrial environments, operating from minus 30 degrees Celsius to 115 degrees Celsius. Its resistance to vibration and shock makes it suitable for factories, energy facilities and outdoor industrial sites. It also reduces bill-of-materials (BoM) costs, board space and system integration complexity.
The IQ-2390 can be used in Human-Machine Interfaces (HMIs), Programmable Logic Controllers (PLCs), gateways, industrial vision systems, building automation and energy management systems. A PLC is an industrial control computer that precisely controls machinery components and sensors and is operated through an HMI.
"With the Dragonwing Q-2390 and IQ-2390 processors, we're enabling intelligence to scale across a much broader range of devices, from retail systems, smart appliances and consumer robots to industrial controllers, machine vision systems and critical infrastructure," Qualcomm vice president Jeff Arnold said. "Together, these platforms help bring advanced edge AI within reach of more customers and more industries than ever before."
Industry partners have also begun developing products based on the processors. Eight Development is preparing a scalable Q-2390-based platform for products in security, fire, life safety and building automation. A scalable platform uses a common processor architecture and standardized software specifications across multiple products.
Fibocom is also developing a Q-2390-based smart wireless communication module for POS systems and industrial handheld devices. SECO and Engicam are developing IQ-2390-based products. SECO is working on a single-board computer (SBC) and HMI, while Engicam is developing an SOM.