COXEM以常压SEM技术瞄准HBM检测
扫描电子显微镜（SEM）专业厂商COXEM正转型为先进半导体封装用无损检测设备制造商，并已开始供货。该公司瞄准HBM检测领域，采用常压SEM技术。原文未披露具体客户、供货数量、金额及时间地点等细节。
原文深度解读
本文介绍韩国扫描电子显微镜（SEM）专业厂商COXEM正转型为先进半导体封装用无损检测设备制造商。公司已开始供应HBM分析用离子束抛光模块，并计划推出面向面板级封装（PLP）和玻璃基板的自动化检测设备。COXEM成立于2007年，2022年全球销售额排名第五。其离子束抛光模块IP-10K基于2019年完成的离子研磨商业化技术，由AP Systems负责组装和销售，CP-SEM产品线成本约为竞争FIB-SEM系统的十分之一。公司预计今年底或明年初通过客户认证并进入量产供应。此外，COXEM正在开发基于常压SEM（A-SEM）技术的Eirtron品牌自动化检测设备，采用石墨烯膜分离电子柱，实现30纳米分辨率，可在常压下观察大面积样品，目前正由韩国一家大型基板公司验证。
- COXEM成立于2007年，最初从韩国标准科学研究院（KRISS）获得技术许可，2010年代初期实现紧凑型台式SEM国产化，2022年全球销售额排名第五。
- COXEM的离子束抛光模块IP-10K基于2019年完成的离子研磨商业化技术，其离子枪模块发射氩（Ar）离子束，设备内还安装独立SEM用于预处理后观察分析，AP Systems负责整机组装和销售。
- 离子束抛光机可自动化处理半导体截面，以每小时1000微米的速度快速去除数毫米宽区域材料，用于检测HBM中的硅通孔（TSV）和微凸块以及MLCC内部层，其CP-SEM产品线成本约为竞争FIB-SEM系统的十分之一。
- COXEM最初为离子枪模块保证100小时耐久性，后提升至数千小时以满足实际半导体量产线要求，预计今年底或明年初通过客户认证测试并进入量产供应。
- COXEM正在开发Eirtron品牌自动化检测设备，基于其自主研发的常压SEM（A-SEM）技术，采用石墨烯膜将电子柱与外部环境完全分离，实现30纳米分辨率，并利用多窗口结构承受一个大气压，注入氦气减少电子束散射和信号损失。
- A-SEM可在常压环境空气中观察样品，消除尺寸限制，无需真空室抽真空或切割样品等复杂预处理步骤；目前测试模型正由韩国一家大型基板公司验证，公司计划将目标客户扩展至OSAT企业。
供应链影响
- 若COXEM的离子束抛光模块通过客户认证并进入量产供应，可能为HBM和MLCC制造环节提供成本更低的截面分析预处理设备，但实际影响取决于认证进度和客户采用规模。
- A-SEM技术若实现商业化，可能使大面积基板（如面板级封装和玻璃基板）的无损检测从离线实验室分析转向产线实时观察，从而可能缩短检测周期，但取决于设备验证结果和量产稳定性。
- COXEM的CP-SEM产品线成本约为FIB-SEM的十分之一，若被广泛采用，可能降低先进封装检测设备的资本支出门槛，但实际供应链影响取决于其性能是否满足量产线要求。
- COXEM计划将A-SEM设备客户从韩国大型基板公司扩展至OSAT企业，可能增加先进封装检测设备市场的供应商多样性，但取决于其产品能否通过更多客户验证。
- COXEM的离子束抛光模块由AP Systems负责组装和销售，若该合作模式扩大，可能形成设备专业厂商与组装销售商之间的供应链分工，但具体影响取决于后续合作范围和市场需求。
系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。
COXEM CEO Lee Jun-hee。（照片：THE ELEC）
COXEM是一家扫描电子显微镜（SEM）专业厂商，正在转型为先进半导体封装用无损检测设备制造商。该公司已开始供应高带宽存储器（HBM）分析用模块，并计划推出面向面板级封装（PLP）和玻璃基板的自动化检测设备。
“离子束抛光机可精确抛光半导体截面，是与一家国内设备公司合作开发成设备的，”COXEM CEO Lee Jun-hee最近在公司位于大田的总部接受采访时表示。“它已经供应给主要半导体制造商，并正在进行量产评估。”
COXEM成立于2007年，是一家韩国SEM开发商和制造商。该公司最初从韩国标准科学研究院（KRISS）获得技术许可。它在2010年代初期实现了紧凑型台式SEM的国产化，并在2022年全球销售额排名第五，确立了其市场竞争力。
Lee拥有韩国科学技术院（KAIST）电气与电子工程博士学位，于2010年加入COXEM担任研究中心负责人，并领导了该技术的研发（R&D）。Lee在2012年因其技术开发能力和业务规划能力获得认可。
用于HBM、MLCC的离子束抛光模块目标明年初获得认证
COXEM的IP-10K离子束抛光机。（照片：COXEM）
离子束抛光机是一种预处理设备，用于在电子显微镜检查样品之前对样品进行蚀刻和抛光。它基于COXEM在2019年完成的离子研磨商业化技术。COXEM的离子枪模块发射氩（Ar）离子束，安装在设备内部。设备还安装了独立的SEM，用于在预处理后观察和分析样品。AP Systems负责整机的组装和销售。
半导体分析实验室传统上主要使用刀片或砂纸手动抛光样品截面。离子束抛光机使该过程自动化。它使用纳米级粒子束创建无误差的平坦截面。与化学机械抛光（CMP）相比，它还能最大限度地减少样品损伤和污染，保留样品的精细结构。
该系统类似于Thermo Fisher Scientific和ZEISS等全球竞争对手的聚焦离子束-扫描电子显微镜（FIB-SEM）系统，但在处理面积和速度上有所不同。FIB-SEM可以精确处理几微米或更小的极小区域，适合纳米级缺陷的详细分析。
离子束抛光机可以以每小时1000微米的速度快速去除数毫米宽区域的材料。它可用于检测HBM中的硅通孔（TSV）和微凸块等结构及缺陷，以及多层陶瓷电容器（MLCC）的内部层。它的成本也更低。COXEM结合离子研磨机和SEM的CP-SEM产品线成本约为竞争FIB-SEM系统的十分之一。
“我们最初为离子枪模块保证100小时耐久性，但已将其提高到数千小时，以满足实际半导体量产线的要求，”Lee说。“我们预计今年底或明年初通过客户认证测试，并进入量产供应。”
用于大基板的无损检测设备正在开发中
COXEM正在开发的Eirtron自动化检测设备。（照片：COXEM）
COXEM还在准备其Eirtron品牌的半导体检测设备。该设备设计用于在制造过程中对大面积样品（包括晶圆、大面板和玻璃基板）进行无损观察。它基于COXEM开发的常压扫描电子显微镜（A-SEM）技术。
传统的大基板检测需要切割截面并将其移至分析实验室。这是因为用于检测的传统SEM依赖密封的高真空腔室，限制了样品尺寸。SEM通过分析被照射电子束反射的信号来检查样品。如果电子束与空气粒子碰撞并散射，信号会减弱，检测到的图像会变得模糊。使用高真空腔室是为了防止这种情况。
A-SEM解决了这个问题，同时保持30纳米分辨率的高分辨率成像。这是通过使用石墨烯膜将包括发射电子束的电子枪在内的电子柱与外部环境完全分离来实现的。
石墨烯具有高电子透过率，允许电子束通过同时阻挡外部空气。多窗口结构使其能够承受一个大气压的压力。石墨烯膜和信号检测器尽可能靠近样品放置，同时注入氦气以最大限度地减少电子束散射和信号损失。这些都是COXEM专利的专有技术。
A-SEM可以在常压环境空气中观察样品，消除了尺寸限制。它还消除了抽真空腔室或切割样品等复杂预处理步骤的需要，有助于减少工艺时间。
“A-SEM技术能够在不损坏样品的情况下在生产线上进行实时观察和分析，这是一项可能改变半导体检测工艺范式的创新，”Lee说。“通过将自动化A-SEM设备商业化，我们的目标是引领目前由Applied Materials和Hitachi等海外公司主导的半导体设备市场。”
COXEM自动化设备的测试模型目前正在由韩国一家大型基板公司进行验证。该公司计划将其目标客户群扩展到外包半导体组装和测试（OSAT）公司。
COXEM CEO Lee Jun-hee. (Photo: THE ELEC)
COXEM, a scanning electron microscope (SEM) specialist, is transforming itself into a maker of nondestructive inspection equipment for advanced semiconductor packaging. The company has begun supplying modules for high-bandwidth memory (HBM) analysis and plans to introduce automated inspection equipment for panel-level packaging (PLP) and glass substrates.
"The ion beam polisher, which precisely polishes semiconductor cross sections, was developed into equipment in collaboration with a domestic equipment company," COXEM CEO Lee Jun-hee said in a recent interview at the company's headquarters in Daejeon. "It has already been supplied to major semiconductor manufacturers and is undergoing mass-production evaluations."
COXEM, founded in 2007, is a South Korean developer and manufacturer of SEMs. The company started by licensing technology from the Korea Research Institute of Standards and Science (KRISS). It localized compact tabletop SEMs in the early 2010s and ranked fifth globally in sales in 2022, establishing its competitiveness in the market.
Lee, who holds a doctorate in electrical and electronic engineering from the Korea Advanced Institute of Science and Technology (KAIST), joined COXEM as head of its research center in 2010 and led research and development (R&D) of the technology. Lee was recognized for his technology development capabilities and business planning skills in 2012.
Ion Beam Polisher Module for HBM, MLCC Targets Qualification Early Next Year
COXEM's IP-10K ion beam polisher. (Photo: COXEM)
An ion beam polisher is preprocessing equipment used to etch and polish a sample before it is examined with an electron microscope. It is based on ion miller commercialization technology that COXEM completed in 2019. COXEM's ion gun module, which emits an argon (Ar) ion beam, is installed inside the equipment. A separate SEM is also installed to observe and analyze the sample after preprocessing. AP Systems handles assembly and sales of the complete equipment.
Semiconductor analysis laboratories have traditionally polished sample cross sections manually, mainly using blades or sandpaper. The ion beam polisher automates the process. It uses a nanometer-scale particle beam to create flat cross sections without errors. It also minimizes sample damage and contamination compared with chemical mechanical polishing (CMP), preserving the sample's fine structures.
The system is similar to focused ion beam-scanning electron microscope (FIB-SEM) systems from global competitors such as Thermo Fisher Scientific and ZEISS, but differs in processing area and speed. FIB-SEM can precisely process extremely small areas of several micrometers or less and is suited to detailed analysis of nanoscale defects.
The ion beam polisher can rapidly remove material across areas as wide as several millimeters at a rate of 1,000 micrometers per hour. It can be used to inspect structures and defects including through-silicon vias (TSVs) and microbumps in HBM, as well as internal layers of multilayer ceramic capacitors (MLCCs). It is also less expensive. COXEM's CP-SEM lineup combining an ion miller and SEM costs about one-tenth as much as competing FIB-SEM systems.
"We initially guaranteed 100 hours of durability for the ion gun module, but have increased that to several thousand hours to meet the requirements of actual semiconductor mass-production lines," Lee said. "We expect to pass customer qualification tests around the end of this year or early next year and move into mass-production supply."
Nondestructive Inspection Equipment for Large Substrates Under Development
COXEM's Eirtron automated inspection equipment under development. (Photo: COXEM)
COXEM is also preparing semiconductor inspection equipment under its Eirtron brand. The equipment is designed for nondestructive observation of large-area samples, including wafers, large panels and glass substrates, during manufacturing. It is based on atmospheric-pressure scanning electron microscope (A-SEM) technology developed by COXEM.
Conventional inspection of large substrates requires cutting cross sections and moving them to an analysis laboratory. This is because conventional SEMs used for inspection rely on sealed high-vacuum chambers, limiting sample size. SEMs inspect samples by analyzing signals reflected from an irradiated electron beam. If the beam collides with air particles and scatters, the signal weakens and the detected image becomes blurred. High-vacuum chambers are used to prevent this.
A-SEM addresses this issue while maintaining high-resolution imaging with 30-nanometer resolution. This is achieved by completely separating the electron column, including the electron gun that emits the beam, from the external environment using a graphene membrane.
Graphene has high electron transmittance, allowing the beam to pass while blocking outside air. A multi-window structure allows it to withstand pressure of one atmosphere. The graphene membrane and signal detector are positioned as close as possible to the sample, while helium gas is injected to minimize electron-beam scattering and signal loss. These are all proprietary technologies patented by COXEM.
A-SEM can observe samples in ambient air at atmospheric pressure, eliminating size restrictions. It also removes the need for complex preprocessing steps such as evacuating a vacuum chamber or cutting samples, helping reduce process time.
"A-SEM technology enables real-time observation and analysis on production lines without damaging samples, making it an innovation that could shift the paradigm of semiconductor inspection processes," Lee said. "By commercializing automated A-SEM equipment, we aim to take the lead in the semiconductor equipment market currently dominated by overseas companies such as Applied Materials and Hitachi."
A test model of COXEM's automated equipment is currently undergoing validation by a major South Korean substrate company. The company plans to expand its target customer base to outsourced semiconductor assembly and test (OSAT) companies.