EE Times原文发布 08-12 18:06Radar 收录 08-12 18:16查看原文 ↗

索尼与台积电47亿美元合作助力抵御三星，分析师称关键事件

Sony-TSMC $4.7B Deal Helps Thwart Samsung, Analysts Say

中文摘要

索尼与台积电达成47亿美元合作，旨在应对三星在智能手机图像传感器领域日益增长的影响力，尤其是针对苹果的订单。该合作涉及产能锁定，可能影响图像传感器供应链的分配格局。

原文深度解读

本文报道了索尼与台积电宣布成立47亿美元合资企业（索尼投资约29亿美元，台积电投资约17.7亿美元），旨在应对三星等竞争对手在苹果智能手机图像传感器市场的挑战。合资企业名为Advanced Vision Semiconductor Manufacturing，位于日本熊本县，预计2029年开始生产。分析师认为该合资企业有助于索尼锁定产能、台积电分散产能、日本政府保障供应链安全，并应对未来图像传感器需求增长（预计2035年出货量达200亿颗）。文章还提及台积电智能手机芯片销售下降、转向AI投资，以及图像传感器制程从65nm/45nm向28nm迁移。

索尼与台积电的合资企业总投资47亿美元，索尼投资4650亿日元（约29亿美元）获得控股权，台积电投资2820亿日元（约17.7亿美元）。
合资企业名为Advanced Vision Semiconductor Manufacturing，位于日本熊本县，预计2029年开始生产，索尼将主导核心图像传感器技术开发及产品规划。
分析师Handel Jones指出，三星在图像传感器领域拥有大晶圆产能，但需从外部购买28nm制程的晶圆；OmniVision也在借助中芯国际的晶圆代工获得市场份额。
Jones预计图像传感器出货量将从2025年的80亿颗增长至2035年的200亿颗，届时可能出现产能短缺。
台积电2026年资本预算提高至640亿美元，以应对AI需求；其智能手机芯片销售在2026年第二季度同比下降4%，占总营收22%。
分析师Dan Hutcheson认为合资企业填补了台积电（分散产能、获取日本工程师）、索尼（供应链安全、获取产能）和日本政府（国家安全）的缺口。

供应链影响

合资企业可能增强索尼在图像传感器领域的产能保障，但实际效果取决于2029年投产后的产能爬坡和市场变化。
台积电可能通过该合资企业进一步分散地缘政治风险，但可能受限于日本政府补贴和当地工程师资源。
图像传感器制程向28nm迁移可能影响现有65nm/45nm产能的利用，相关供应链调整可能取决于客户需求。
未来图像传感器需求增长（2035年200亿颗）可能加剧晶圆产能竞争，但具体影响取决于AI和机器人市场的实际发展。
三星和OmniVision的竞争可能促使索尼调整定价或技术路线，但供应链格局变化取决于各厂商的产能投资和客户订单。

系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。

正文内容 · AI翻译

中文英文

索尼与台积电本周宣布的47亿美元合资企业旨在抵御三星等竞争对手在苹果智能手机图像传感器领域的渗透，分析师对EE Times如此评论。

索尼将投资4650亿日元（约29亿美元）获得控股权，而台积电将提供剩余的2820亿日元（约17.7亿美元），两家公司在各自的新闻声明中表示。新合资企业Advanced Vision Semiconductor Manufacturing的生产预计于2029年开始，索尼表示。合资企业将位于日本熊本县，台积电正在那里与包括索尼、电装和丰田在内的少数股东进行另一项合作。

索尼打算通过开发核心图像传感器技术以及产品规划和设计来领导新合资企业。合资企业将利用台积电的先进工艺技术和制造专长。

苹果

索尼正在提高与三星等图像传感器竞争对手的竞争筹码，三星正在获得市场份额并从苹果赢得更多订单，国际商业策略公司首席执行官Handel Jones告诉EE Times。

作者：Juergen Jaeger，西门子EDA原型产品战略总监，2026年8月10日

作者：Piyush Sancheti，中央工程解决方案（3D IC）副总裁，以及Todd Burkholder，3D IC技术作家，西门子EDA，2026年8月5日

作者：Alessandro Chimera，Spotfire行业解决方案负责人，2026年8月5日

“三星拥有大量的图像传感器晶圆产能，但正在从外部供应商购买28纳米节点的晶圆用于图像传感器处理支持，”Jones说，但没有透露三星的供应商。“总部位于加利福尼亚的OmniVision也在成像领域获得市场份额，其关键晶圆供应商是中国代工厂中芯国际。索尼面临的关键挑战是如何在成像应用中对抗三星和OmniVision获得合理利润。”

索尼和三星是最大的图像传感器制造商，其次是OmniVision、安森美、佳能和意法半导体。

Jones表示，他预计全球图像传感器产能短缺将出现，因为出货量将从2025年的80亿颗增长到2035年的200亿颗，翻了一倍多。

机器人

“虽然智能手机是最大的市场，但还有许多其他增长市场，包括机器人、数字健康、安全和监控，”Jones说。“物理AI将成为图像传感器的大市场，获得大规模晶圆和混合键合制造产能至关重要。”

很容易将索尼-台积电合资企业视为物理AI基础设施布局，以应对即将到来的机器人需求激增，TechInsights副主席Dan Hutcheson告诉EE Times。

Hutcheson补充说，该合资企业是两家公司和日本政府的长期战略举措。索尼表示，实现合资企业计划产能所需的投资是基于获得日本政府支持的假设。

今年第二季度，台积电智能手机芯片销售额同比下降4%，占公司总营收的22%。就在几年前，智能手机还是台积电最大的业务。台积电已转移重心，将2026年资本预算提高到高达640亿美元，以努力跟上AI客户飙升的需求。

填补缺口

该合资企业填补了重要缺口，Hutcheson说。

“台积电需要将产能分散到台湾以外，”Hutcheson说。“它需要获得日本过剩的熟练半导体工程师，而台湾缺乏这些工程师。索尼需要本地化其供应链安全，以及获得台积电的产能。日本政府需要安全的本地制造产能以保障国家安全。”

台积电一直是美国、日本和欧洲的国家安全问题，这些国家吸引了这家领先芯片代工厂的投资，以帮助重建萎靡的国内芯片产业。

虽然索尼在智能手机领域以其Xperia系列竞争，但索尼图像传感器几乎出现在一半的智能手机中，Hutcheson补充说。

“这包括苹果、三星、谷歌和小米的部分型号，”他指出。

图像传感器当前主流生产技术在65纳米和45纳米节点，正在向28纳米迁移，Jones说。台积电已经为索尼在65纳米节点制造图像传感器晶圆，他指出。

另请阅读：

芯片制造、图像传感器、合资企业、物理AI、机器人、半导体、智能手机、晶圆产能

苹果、三星、索尼、台积电

Alan Patterson

Alan在亚洲担任电子记者大部分职业生涯。除了EE Times，他还曾担任彭博新闻和道琼斯通讯社的记者和编辑。他在香港和台北生活了30多年，期间报道了大中华地区的科技公司。

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The $4.7 billion joint venture between Sony and TSMC announced this week is aimed at fending off rivals such as Samsung that are making inroads in image sensors used in Apple smartphones, according to analysts who commented to EE Times.

Sony will invest 465 billion yen (~$2.9 billion) for a controlling stake in the venture while TSMC will provide the remaining 282 billion yen (~$1.77 billion), the companies said in separate press statements. Production at the new JV, Advanced Vision Semiconductor Manufacturing, is expected to start in 2029, according to Sony. The JV will be located in Japan’s Kumamoto Prefecture, where TSMC is making chips in a separate partnership with minority investors including Sony, Denso, and Toyota.

Sony intends to lead the new venture by developing core image sensor technologies, as well as product planning and design. The JV will tap TSMC’s advanced process technology and manufacturing expertise.

Apple

Sony is raising the stakes in its competition with image sensor rivals such as Samsung, which is gaining market share and winning more orders from Apple, International Business Strategies CEO Handel Jones told EE Times.

By Juergen Jaeger, Director of Prototyping Product Strategy, Siemens EDA 08.10.2026

By Piyush Sancheti, VP Central Engineering Solutions (3D IC), and Todd Burkholder, 3D IC Technology Writer, Siemens EDA 08.05.2026

By Alessandro Chimera, Industry Solutions Lead, Spotfire 08.05.2026

“Samsung has large wafer capacity for image sensors but is buying wafers from external vendors for image sensor processing support at the 28-nm node,” Jones said, without naming the Samsung suppliers. “OmniVision, based in California, is also gaining market share in imaging with Chinese foundry SMIC as a key wafer vendor. A key challenge for Sony is how to make reasonable profits from imaging applications against Samsung and OmniVision.”

Sony and Samsung are the largest image sensor makers, followed by OmniVision, onsemi, Canon, and STMicroelectronics.

Jones said he expects global capacity shortages for imaging sensors to emerge as volumes shipped more than double to 20 billion units in 2035 from 8 billion in 2025.

Robots

“While smartphones represent the largest market, there are many other growth markets including robotics, digital health, security, and surveillance,” Jones said. “Physical AI will be a big market for image sensors, and having access to large manufacturing capacity for wafers and hybrid bonding is critical.”

It would be easy to see the Sony-TSMC JV as a physical AI infrastructure play to address a coming surge in robot demand, TechInsights vice chair Dan Hutcheson told EE Times.

The JV is a long-term strategic move for both companies and the Japanese government, Hutcheson added. Investments required to realize the production capacity planned by the JV are based on the premise that they would receive support from the Japanese government, Sony said.

In the second quarter this year, TSMC’s sales of chips for smartphones fell 4% from a year ago to account for 22% of the company’s total sales revenue. Just a few years ago, smartphones accounted for TSMC’s largest business. TSMC has shifted its focus, increasing its 2026 capital budget to as much as $64 billion as it tries to catch up with soaring demand from AI customers.

Plugging gaps

The JV plugs important gaps, according to Hutcheson.

“TSMC needs to diversify its production capacity outside of Taiwan,” Hutcheson said. “It needs access to Japan’s surplus of skilled semiconductor engineers, for which there is a shortage in Taiwan. Sony needs to localize its supply chain security as well as access to TSMC’s capacity. Japan’s government needs secure local manufacturing capacity for national security reasons.”

TSMC has been a national security issue for the U.S., Japan, and Europe, which have attracted investment from the leading chip foundry to help rebuild flagging domestic chip industries.

While Sony competes in smartphones with its Xperia series, Sony image sensors are in nearly half the smartphones sold, Hutcheson added.

“This includes select models from Apple, Samsung, Google, and Xiaomi,” he noted.

The current mainstream production technology for image sensors, at the 65-nm and 45-nm nodes, is moving to 28 nm, Jones said. TSMC already makes image sensor wafers for Sony at the 65-nm node, he noted.