← 返回全部时间线
TrendForce Press Center原文发布 09-11 14:29Radar 收录 09-11 14:36查看原文 ↗

TrendForce:2026年第二季度全球十大无晶圆厂IC设计公司营收同比增长73%,AMD首次跻身前三

Top 10 Global Fabless IC Design Houses Post 73% YoY Revenue Growth in 2Q26; AMD Breaks into Top Three, Says TrendForce
中文摘要

TrendForce最新IC设计产业研究显示,AI应用持续扩张带动GPU、CPU、ASIC及互连产品需求,2026年第二季度全球前十大无晶圆厂IC设计公司合计营收同比增长73%,AMD首次进入前三名。

原文深度解读

本文基于TrendForce的IC设计产业研究,概述2026年第二季度全球前十大无晶圆厂IC设计公司的营收表现。文章指出,AI应用扩张带动GPU、CPU、ASIC及互连产品需求,前十大厂商合计营收同比增长73%至超过1414.5亿美元。NVIDIA保持第一,AMD升至第三,Qualcomm降至第四。文章还分别介绍了Broadcom、Marvell、MediaTek、Realtek、MPS、Novatek、OmniVision等厂商的业绩与业务动向,涉及AI ASIC、数据中心CPU、光互连、电源管理、CIS等与电子元器件供应链密切相关的领域。

  • TrendForce研究显示,2026年第二季度全球前十大无晶圆厂IC设计公司合计营收同比增长73%,超过1414.5亿美元,主要受AI应用扩张带动GPU、CPU、ASIC及互连产品需求推动。
  • NVIDIA 2026年第二季度营收同比增长99%至近911.6亿美元,占前十大公司合计营收的64%;其增长动力包括超大规模CSP、NeoCloud运营商、主权AI项目以及企业客户。
  • Broadcom排名第二,2026年第二季度营收同比增长112%至超过188.9亿美元;其为OpenAI设计的首款ASIC和Google TPU 8i于该季度开始出货,网络业务随XPU部署快速增长,六大定制芯片客户包括Anthropic和OpenAI等前沿模型开发商。
  • AMD升至第三,2026年第二季度营收超过115.3亿美元,数据中心CPU营收连续第五个季度创历史新高,并在x86服务器市场持续从Intel获取份额;agentic AI的兴起重新提升了CPU的战略重要性。
  • Marvell排名第六,2026年第二季度营收26.3亿美元,在PAM4 DSP领域保持领先,800G DSP需求强劲且1.6T产品快速上量;其与Google在定制芯片业务达成协议,预计将在2029财年做出显著营收贡献。
  • Qualcomm排名第四,营收超过85亿美元,智能手机芯片业务持续面临挑战且在新款iPhone中调制解调器芯片份额下降,但汽车业务连续23个季度实现同比两位数增长;MediaTek排名第五,营收约48.1亿美元,同样受智能手机业务拖累,但上调AI ASIC展望,预计2026年数据中心营收超过20亿美元,并将2028年ASIC可服务市场预估上调至800亿美元。

供应链影响

  • AI ASIC和XPU需求增长可能持续拉动先进制程晶圆代工、先进封装及高速互连芯片(如PAM4 DSP、800G/1.6T光模块相关芯片)的供应链需求,具体影响取决于客户部署节奏和产能释放情况。
  • NVIDIA通过NVLink Fusion生态及对MediaTek、Marvell的投资,可能推动定制XPU与现有NVIDIA基础设施的互操作性需求,进而影响相关互连芯片和IP授权供应链的协作模式。
  • AMD在x86服务器CPU市场份额提升以及数据中心CPU营收创新高,可能对服务器CPU及相关配套芯片(如电源管理、高速接口)的供应链格局产生影响,但取决于Intel的竞争应对和下游服务器需求变化。
  • Qualcomm和MediaTek智能手机业务承压,而汽车、AI ASIC和数据中心业务增长,可能促使相关芯片设计公司调整产品组合,进而影响手机芯片、汽车芯片和数据中心芯片在代工及封测环节的产能分配。
  • OmniVision提到存储价格上涨压制智能手机和汽车CIS业务,同时拓展光通信模拟IC(TIA和驱动IC),可能反映存储价格波动对CIS供应链成本的影响,以及光通信模拟芯片供应链可能迎来新的参与者,但实际影响取决于价格走势和客户导入进度。

系统解读,仅作为判断线索,不构成备货、出货、涨价或投资建议。

正文内容 · AI翻译

根据TrendForce最新的IC设计产业研究,AI应用的持续扩张继续推动GPU、CPU、ASIC和互连产品的需求。因此,2026年第二季度全球前十大无晶圆厂IC设计公司的合计营收同比激增73%,超过1414.5亿美元。

NVIDIA稳居第一,而AMD升至第三,因为CPU在agentic AI应用中的战略重要性上升。Qualcomm因智能手机业务疲软下滑至第四。

NVIDIA 2026年第二季度营收同比增长99%,达到近911.6亿美元,使其在前十大公司合计营收中的份额增至64%。除了超大规模CSP、NeoCloud运营商和主权AI项目外,企业客户也为该公司营收做出了显著贡献。

TrendForce观察到,NVIDIA近期扩展了其NVLink Fusion生态系统,使其能够涉足ASIC市场。该公司对MediaTek的投资旨在帮助定制XPU客户改善与现有NVIDIA基础设施的互操作性,同时为未来汽车AI应用奠定基础。NVIDIA此前对Marvell的投资同样将NVLink Fusion列为合作领域。

Agentic AI提升CPU的战略角色,光互连对扩展算力变得至关重要

Broadcom在2026年第二季度排名第二。其协助OpenAI设计的首款ASIC和Google的TPU 8i于该季度开始出货,同时其网络业务随XPU部署快速增长。营收同比激增112%,超过188.9亿美元。其六大定制芯片客户,包括Anthropic和OpenAI等前沿模型开发商,预计将继续推动XPU需求。

AMD升至第三,因为agentic AI的兴起重新凸显了CPU的战略重要性。其2026年第二季度营收超过115.3亿美元,数据中心CPU营收连续第五个季度创下历史新高。该公司还在x86服务器市场继续从Intel获取份额。

互连需求的快速增长将Marvell 2026年第二季度营收推升至26.3亿美元,排名第六。该公司在PAM4 DSP领域保持领先地位,800G DSP需求强劲,1.6T产品快速上量。Marvell还在其定制芯片业务中与Google达成协议,预计将在2029财年做出显著营收贡献。

移动芯片领导者扩展其AI战略

2026年第二季度,Qualcomm在智能手机芯片领域面临持续挑战,且在新款iPhone中调制解调器芯片的份额下降。尽管如此,其汽车部门已连续23个季度保持同比两位数增长,帮助抵消了智能手机业务的部分下滑。该公司营收超过85亿美元。近期,Qualcomm还重返数据中心市场,增强了其QCT部门的多元化。

MediaTek排名第五,营收约48.1亿美元,同样受到智能手机业务的拖累。然而,该公司上调了AI ASIC的展望,并预计2026年数据中心营收将超过20亿美元。它还将2028年ASIC的可服务市场预估上调至800亿美元。

消费类IC设计公司受益于需求提前拉动,同时寻求新的增长动力

Realtek排名第七,2026年第二季度营收近11.9亿美元。由于预计2026年下半年PC市场状况将进一步走弱,该公司计划利用其现有IP优势拓展服务器市场,包括10G以太网和服务器控制平面交换机。

MPS排名第八,营收9.81亿美元,主要受AI相关电源管理解决方案推动。该公司在向更广泛的半导体解决方案提供商转型的过程中继续扩大产能。

Novatek排名第九,2026年第二季度营收9.07亿美元,得益于客户提前拉动需求。SoC现在占其营收的一半以上,该公司继续投资于边缘AI相关的机器视觉SoC应用。

OmniVision排名第十,半导体设计营收8.38亿美元。尽管存储价格上涨压制了其智能手机和汽车CIS业务,但运动相机等新兴应用增长强劲。该公司还在将其模拟IC产品组合扩展至光通信EIC,包括跨阻放大器(TIA)和驱动IC。

According to TrendForce’s latest IC design industry research, expanding AI applications continued to drive demand for GPUs, CPUs, ASICs, and interconnect products. Consequently, combined revenue of the world’s top 10 fabless IC design companies surged 73% YoY to more than US$141.45 billion in 2Q26.

NVIDIA remained firmly in first place, while AMD moved up to third as CPUs gained strategic importance in agentic AI applications. Qualcomm slipped to fourth amid weakness in its smartphone business.

NVIDIA’s 2Q26 revenue rose 99% YoY to nearly $91.16 billion, increasing its share of the top 10 companies’ combined revenue to 64%. In addition to hyperscale CSPs, NeoCloud operators, and sovereign AI projects, enterprise customers contributed significantly to the company’s revenue.

TrendForce observes that NVIDIA has recently expanded its NVLink Fusion ecosystem, enabling it to engage with the ASIC market. The company’s investment in MediaTek is intended to help custom XPU customers improve interoperability with existing NVIDIA infrastructure while also laying the groundwork for future automotive AI applications. NVIDIA’s earlier investment in Marvell similarly included NVLink Fusion as a collaboration area.

Agentic AI elevates CPU’s strategic role as optical interconnects become critical to scaling compute

Broadcom ranked second in 2Q26. The first ASIC it helped design for OpenAI and Google’s TPU 8i began shipping during the quarter, while its networking business grew rapidly alongside XPU deployments. Revenue surged 112% YoY to more than $18.89 billion. Its six major custom chip customers, including frontier model developers such as Anthropic and OpenAI, are expected to continue driving XPU demand.

AMD moved into third place as the rise of agentic AI renewed the strategic importance of CPUs. Its 2Q26 revenue exceeded $11.53 billion, while data center CPU revenue reached a record high for the fifth consecutive quarter. The company also continued to gain share from Intel in the x86 server market.

Rapid growth in interconnect demand lifted Marvell’s 2Q26 revenue to $2.63 billion, placing it sixth. The company maintains a leading position in PAM4 DSPs, with strong demand for 800G DSPs and a rapid ramp-up in 1.6T products. Marvell has also reached an agreement with Google in its custom silicon business, which is expected to make a significant revenue contribution in fiscal 2029.

Mobile chip leaders expand their AI strategies

In 2Q26, Qualcomm faced ongoing challenges in its smartphone chip segment and a reduced share of modem chips in the newest iPhone model. Nevertheless, its automotive division has sustained double-digit year-over-year growth for 23 straight quarters, helping to offset a part of the decline in smartphones. The company earned over $8.5 billion in revenue. Recently, Qualcomm has also returned to the data center market, boosting diversification within its QCT division.

MediaTek ranked fifth with revenue of approximately $4.81 billion, also weighed down by its smartphone business. However, the company raised its outlook for AI ASICs and expects data center revenue to exceed $2 billion in 2026. It has also increased its estimate for ASIC’s serviceable available market to $80 billion by 2028.

Consumer IC design houses benefit from early pull in demand while seeking new growth drivers

Realtek ranked seventh with 2Q26 revenue of nearly $1.19 billion. With PC market conditions expected to weaken further in the second half of 2026, the company plans to leverage its existing IP strengths to expand into the server market, including 10G Ethernet and server control-plane switches.

MPS ranked eighth with revenue of $981 million, primarily driven by AI-related power management solutions. The company continues to expand capacity as it transitions toward becoming a broader semiconductor solutions provider.

Novatek ranked ninth with 2Q26 revenue of $907 million, supported by early pull in demand from customers. SoCs now account for more than half of its revenue, and the company continues to invest in edge AI-related machine-vision SoC applications.

OmniVision ranked tenth, with semiconductor design revenue of $838 million. Although higher memory prices weighed on its smartphone and automotive CIS businesses, emerging applications such as action cameras posted strong growth. The company is also expanding its analog IC portfolio into EICs for optical communications, including transimpedance amplifiers (TIAs) and driver ICs.

↑