英伟达发布下一代CPO技术
英伟达发布下一代共封装光学（CPO）技术，将光引擎直接放置在承载计算芯片的interposer上，而非封装基板上。原文未提供更多细节。
原文深度解读
本文报道英伟达在SEMICON West 2026上发布下一代共封装光学（CPO）技术，核心是将光引擎直接放置在承载计算芯片的interposer上，而非封装基板上，称为optics-on-interposer（OOI）。英伟达研究员Nikola Nedovic于10月13日在旧金山介绍了该研究，并同时展示了密集波分复用（DWDM）技术，演示8个波长、每个32Gb/s、单纤256Gb/s。两项技术均处于研究阶段。文章还介绍了英伟达已量产的CPO产品Quantum-X Photonics和Spectrum-X Photonics，以及由台积电、SPIL、Coherent、Lumentum、住友电工、康宁、Senko、Browave、TFC、富士康、Fabrinet等组成的CPO制造生态。该内容与电子元器件供应链的关系在于：CPO及OOI涉及光引擎、硅光封装、外部激光源、光纤连接器、冷却与测试等环节，可能影响相关光通信与先进封装供应链的分工与协作。
- 英伟达发布的OOI技术将光引擎从有机封装基板移到承载计算芯片的interposer上，电信号直接通过interposer的短、细间距互连传输，类似GPU与HBM之间的架构；现有量产CPO仍将信号从芯片经interposer和有机基板路由到光引擎，而OOI去掉了有机基板这一路径。
- 英伟达同时发布DWDM技术，用多个光波长传输独立数据流并在接收端分离，演示了8个波长、每个32Gb/s，合计每根光纤256Gb/s。
- 两项技术均处于研究阶段；Nedovic表示正在为未来产品提出和评估技术，同时解决阻碍商业化的挑战。
- 英伟达已量产CPO产品包括Quantum-X Photonics和Spectrum-X Photonics：Quantum-X用插座将光纤连接的光引擎安装在基板上，用于连接基于Blackwell Ultra的GB300 NVL72机架的InfiniBand网络；Spectrum-X使用焊接光引擎和可拆卸光纤连接器，部署于Vera Rubin平台的以太网交换机。
- 英伟达已建立CPO制造生态：台积电提供COUPE硅光封装技术，集成EIC和PIC，并与台湾半导体封测公司SPIL共同代工；Coherent、Lumentum和住友电工制造外部激光源模块；康宁、Senko、Browave和TFC供应光纤及相关组件；富士康和Fabrinet负责冷却和最终测试。
- Nedovic强调量产需要完整生态，关键合作伙伴须提供组装前后测试、光纤对准、温度控制、冷却和维护技术，以确保光引擎能承受封装组装工艺。
供应链影响
- OOI若从研究走向量产，可能使有机封装基板在CPO电信号路径中的角色发生变化，具体影响取决于interposer互连与封装工艺的成熟度。
- DWDM演示的8波长、每纤256Gb/s能力，可能影响未来光模块与光纤连接环节的带宽密度需求，但取决于其能否商业化。
- 英伟达已列出的CPO生态伙伴覆盖硅光封装、外部激光源、光纤组件、冷却与测试，可能意味着相关环节的供应链协作与认证要求会随CPO量产而调整。
- Quantum-X与Spectrum-X分别采用插座式和焊接式光引擎及不同连接方式，可能使光纤连接器、封装和测试环节出现差异化的供应需求。
- Nedovic提到光引擎需承受封装组装工艺，并需要组装前后测试、光纤对准、温度控制、冷却和维护技术，可能提高相关测试、对准与热管理环节在供应链中的重要性。
系统解读，仅作为判断线索，不构成备货、出货、涨价或投资建议。
英伟达在SEMICON West 2026上发布的interposer上光学（OOI）技术。（照片：THE ELEC）
英伟达发布了下一代共封装光学（CPO）技术，将光引擎直接放置在承载计算芯片的interposer上，而不是封装基板上。
通过从电信号路径中去除有机基板，该技术可以提高带宽密度并降低功耗。英伟达表示已开发出原型。
英伟达首席研究员Nikola Nedovic于10月13日在旧金山举行的SEMICON West 2026上介绍了这项研究。
这项被称为interposer上光学（OOI）的技术，将光引擎从有机封装基板移到承载计算芯片的interposer上。电信号直接通过interposer的短、细间距互连传输，类似于连接图形处理单元（GPU）和高带宽内存（HBM）的架构。虽然现有量产的CPO使光引擎更靠近芯片，但OOI将它们放得更近。当前设计将信号从芯片经interposer和有机基板路由到光引擎。OOI从该路径中去除了有机基板。
英伟达还发布了密集波分复用（DWDM）技术，旨在增加单根光纤承载的数据量。该技术使用多个光波长传输独立数据流，并在接收端分离。英伟达演示了8个波长，每个以32Gb/s运行，每根光纤提供256Gb/s。
两项技术仍处于研究阶段。Nedovic说：“我们正在为未来产品提出和评估技术，同时解决阻碍商业化的挑战。”
CPO将光引擎和交换机专用集成电路（ASIC）集成在同一封装内。传统网络设备将电信号发送到安装在交换机前面板上的可插拔光收发器，在那里转换为光信号。CPO将包含光调制器和光电探测器等组件的光引擎移到ASIC旁边。激光器被分离为外部光源模块，从而实现高密度连接，同时降低功耗和发热。
英伟达量产的CPO交换机封装，光引擎围绕中央交换机芯片排列。（来源：英伟达）
英伟达已在量产产品中部署CPO技术，包括Quantum-X Photonics和Spectrum-X Photonics。Quantum-X使用插座将光纤连接的光引擎安装在基板上，而Spectrum-X使用焊接光引擎和可拆卸光纤连接器。Quantum-X用于连接基于Blackwell Ultra的GB300 NVL72机架的InfiniBand网络，而Spectrum-X部署于Vera Rubin平台的以太网交换机。
英伟达已与多个合作伙伴建立CPO制造生态。台积电提供其COUPE硅光封装技术，该技术集成电子集成电路（EIC）和光子集成电路（PIC）。台积电还与台湾半导体封装测试公司SPIL共同负责代工制造。Coherent、Lumentum和住友电工制造外部激光源模块，而康宁、Senko、Browave和TFC供应光纤及相关组件。富士康和Fabrinet负责冷却和最终测试。
Nedovic说：“需要整个生态系统才能使CPO技术适合量产。关键合作伙伴必须提供组装前后测试、光纤对准、温度控制、冷却和维护技术，以确保光引擎能够承受封装组装工艺。”
Nvidia’s optics-on-interposer (OOI) technology unveiled at SEMICON West 2026. (Photo: THE ELEC)
Nvidia has unveiled next-generation co-packaged optics (CPO) technology that places optical engines directly on the interposer carrying computing chips rather than on the package substrate.
By eliminating the organic substrate from the electrical signal path, the technology can increase bandwidth density and reduce power consumption. Nvidia said it has developed a prototype.
Nikola Nedovic, a principal researcher at Nvidia, presented the research at SEMICON West 2026 in San Francisco on Oct. 13.
The technology, called optics-on-interposer (OOI), moves optical engines from the organic package substrate onto the interposer that carries computing chips. Electrical signals travel directly through the interposer’s short, fine-pitch interconnects, similar to the architecture connecting graphics processing units (GPUs) and high-bandwidth memory (HBM). While existing mass-produced CPO brings optical engines closer to chips, OOI places them even closer. Current designs route signals from the chip through the interposer and organic substrate to the optical engine. OOI eliminates the organic substrate from that path.
Nvidia also unveiled dense wavelength-division multiplexing (DWDM) technology designed to increase the amount of data carried by a single optical fiber. The technology transmits separate data streams using multiple wavelengths of light, which are separated at the receiver. Nvidia demonstrated eight wavelengths operating at 32Gb/s each, delivering 256Gb/s per fiber.
Both technologies remain in the research stage. “We are proposing and evaluating technologies for future products while addressing the challenges that prevent commercialization,” Nedovic said.
CPO integrates optical engines and switch application-specific integrated circuits (ASICs) within the same package. Conventional networking equipment sends electrical signals to pluggable optical transceivers mounted on the front panel of a switch, where they are converted into optical signals. CPO moves optical engines containing components such as optical modulators and photodetectors next to the ASIC. Lasers are separated into external light source modules, enabling high-density connectivity while reducing power consumption and heat generation.
Nvidia’s mass-produced CPO switch package, with optical engines arranged around the central switch chip. (Source: Nvidia)
Nvidia has already deployed CPO technology in mass-produced products, including Quantum-X Photonics and Spectrum-X Photonics. Quantum-X mounts fiber-connected optical engines on the substrate using sockets, while Spectrum-X uses soldered optical engines and detachable fiber connectors. Quantum-X is used in InfiniBand networks connecting Blackwell Ultra-based GB300 NVL72 racks, while Spectrum-X is deployed in Ethernet switches for the Vera Rubin platform.
Nvidia has established a CPO manufacturing ecosystem with multiple partners. TSMC provides its COUPE silicon photonics packaging technology, which integrates electronic integrated circuits (EICs) and photonic integrated circuits (PICs). TSMC also handles contract manufacturing alongside Taiwan-based semiconductor assembly and testing company SPIL. Coherent, Lumentum and Sumitomo Electric manufacture external laser source modules, while Corning, Senko, Browave and TFC supply optical fibers and related components. Foxconn and Fabrinet handle cooling and final testing.
“An entire ecosystem is needed to make CPO technology suitable for mass production,” Nedovic said. “Key partners must provide pre- and post-assembly testing, fiber alignment, temperature control, cooling and maintenance technologies to ensure optical engines can withstand package assembly processes.”