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EE Times原文发布 10-30 00:20Radar 收录 10-30 00:31查看原文 ↗

三星电子因AI存储需求实现800亿美元营业利润

Samsung Electronics Posts $80B Operating Profit on AI Memory Demand
中文摘要

三星电子公布第三季度营业利润为800亿美元。元器件价格上涨导致其移动业务出现营业亏损。

原文深度解读

文章报道三星电子2026年第三季度业绩:合并营收195.3万亿韩元(约1460亿美元),营业利润107.4万亿韩元(约800亿美元),主要受全球AI内存芯片需求推动。半导体部门(DS)营收147.1万亿韩元、营业利润106.5万亿韩元,而包含智能手机、电视和家电的消费电子部门(DX)营收52.1万亿韩元、营业亏损0.8万亿韩元。内存价格上涨(标准DRAM从每吉比特20-30美分升至2美元,HBM4预计达4美元)推高手机物料成本,导致MX及网络业务营收37.7万亿韩元但营业亏损0.6万亿韩元。三星HBM产能已售罄至2027年,并已与10家关键客户签订多年供应协议。文章还提及SK海力士第三季度业绩、股东回报计划及市场反应。与电子元器件供应链的关系在于:AI内存需求重塑存储芯片定价与产能分配,并通过物料成本传导至下游消费电子制造。

  • 三星电子第三季度合并营收195.3万亿韩元(约1460亿美元),营业利润107.4万亿韩元(约800亿美元),成为全球首家季度营业利润超过100万亿韩元(约750亿美元)的科技公司。
  • 半导体部门(DS)营收147.1万亿韩元(约1100亿美元),营业利润106.5万亿韩元(约800亿美元);消费电子部门(DX)营收52.1万亿韩元(约390亿美元),营业亏损0.8万亿韩元(约6亿美元),显示元器件制造与成品消费电子业绩分化明显。
  • Counterpoint Research指出标准DRAM价格从每吉比特20-30美分升至2美元,全球DRAM市场规模扩大至2000亿美元;三星DRAM营业利润率79%,NAND闪存72%;随着HBM市场增长,HBM4价格预计达每吉比特4美元。
  • 内存涨价推高手机物料成本:三星MX及网络业务营收37.7万亿韩元(约282.1亿美元),营业亏损0.6万亿韩元(约4.5亿美元);分析师称低端机型预计继续亏损,三星可能缩减其销量贡献,暗示供应链市场销量动态将进一步调整。
  • 三星已与10家关键客户签订多年供应协议,其HBM产能目前售罄至2027年;竞争对手SK海力士称其HBM产能售罄至2029年。Counterpoint Research预计三星将在HBM4世代超越SK海力士,并于2027年领跑市场份额。
  • 三星宣布第三季度现金股息30万亿韩元(约220亿美元),2026年股东总回报计划估计为90万亿韩元(约670亿美元)至110万亿韩元(约820亿美元);尽管营业利润高企,股价在财报电话会期间下跌,分析师认为股东回报未带来上行惊喜。

供应链影响

  • AI内存需求可能持续挤占标准DRAM和HBM产能,导致存储芯片供应向高附加值产品倾斜,下游消费电子厂商的物料成本压力可能延续。
  • 三星HBM产能售罄至2027年、SK海力士售罄至2029年,表明高端AI内存供应紧张可能持续,具体缓解时点取决于产能扩张进度和客户协议执行情况。
  • 内存价格高企可能促使三星等手机厂商调整低端机型销量贡献,进而影响上游元器件在低端手机市场的需求结构和供应链订单分布。
  • 三星与10家关键客户签订多年供应协议,可能增强其存储芯片供应的长期锁定效应,其他买家获取HBM及先进内存的难度可能取决于剩余产能和协议覆盖范围。
  • 三星资本配置与股东回报计划可能影响其长期产能投资节奏,进而对存储芯片供应链的扩产速度和供需平衡产生间接影响,具体取决于后续资本支出执行情况。

系统解读,仅作为判断线索,不构成备货、出货、涨价或投资建议。

正文内容 · AI翻译

三星电子公布第三季度合并营收195.3万亿韩元(约1460亿美元),营业利润107.4万亿韩元(约800亿美元)。全球AI内存芯片的强劲需求支撑了业绩。

三星表示,它是全球首家季度营业利润超过100万亿韩元(约750亿美元)的科技公司,这体现了AI基础设施支出如何驱动全球供应链中的硬件经济。

然而,元器件价格上涨拖累了三星的移动业务,同时其股东回报计划未达到投资者预期。

芯片与消费设备之间的财务分化

财报凸显了三星元器件制造与成品消费电子之间的鲜明对比。设备解决方案(DS)半导体部门营收147.1万亿韩元(约1100亿美元),营业利润106.5万亿韩元(约800亿美元)。相比之下,包含智能手机、电视和家电的设备体验(DX)部门营收52.1万亿韩元(约390亿美元),营业亏损0.8万亿韩元(约6亿美元)。

作者:Dima Mymrikov,Renesas Electronics GreenPAK产品营销高级总监,2026年10月29日

作者:Aaron Fellis,Lam Research湿法设备技术系统公司副总裁兼总经理,2026年10月26日

作者:Vasanth Sista,TE Connectivity现场应用工程师,2026年10月26日

“又一个破纪录的季度,超出市场一致预期,”Counterpoint Research研究总监MS Hwang表示,并指出半导体营业利润超过100万亿韩元(约750亿美元),而成品消费设备部门则陷入营业亏损。

内存定价与供应链调整

内存定价推动了三星半导体与消费设备业务之间的分化。Counterpoint Research认为,标准DRAM价格从每吉比特20-30美分的历史区间升至每吉比特2美元,使全球DRAM市场扩大至2000亿美元。三星报告DRAM营业利润率为79%,NAND闪存为72%。同时,随着高带宽内存市场(HBM)增长,HBM4价格预计将达到每吉比特4美元。

内存价格上涨给手机制造的物料清单带来压力。三星移动体验(MX)及网络业务营收37.7万亿韩元(约282.1亿美元),但营业亏损0.6万亿韩元(约4.5亿美元)。

“(消费电子)MX部门继续因高内存定价而受损,”Hwang表示。“由于低端机型预计将继续亏损,三星可能缩减其销量贡献,这意味着供应链中的市场销量动态将进一步调整。”

在财报电话会前的演示中,三星移动副总裁Daniel Araujo指出,该业务旨在“通过效率提升缓解盈利风险”,并“改善以旗舰产品为中心的产品组合”。

HBM扩张

三星的业绩与SK海力士的报告一致,后者第三季度营收104.62万亿韩元(约780亿美元),营业利润83.33万亿韩元(约620亿美元)。

三星HBM4堆栈(来源:三星)

该公司表示,凭借产品竞争力,“大幅扩大了HBM4的销售”,同时在“产能受限的情况下,管理产品组合,聚焦AI产品”。

在财报电话会上,三星电子内存业务执行副总裁Jaejune Kim表示,公司已与10家关键客户签订多年供应协议。然而,尽管竞争对手SK海力士称其HBM产能已售罄至2029年,三星确认其HBM产能目前售罄至2027年。

Counterpoint Research预计三星将在先进内存领域取得进展。“我们预计三星将从HBM4世代开始超越SK海力士,在2027年领跑市场份额,”Hwang在评论SK海力士业绩时表示。

资本配置加剧投资者压力

尽管营业利润高企,三星股价在财报电话会期间下跌,因资本配置计划符合预期。公司宣布第三季度现金股息30万亿韩元(约220亿美元),作为2026年估计总额900万亿韩元(约670亿美元)至1100万亿韩元(约820亿美元)股东总回报计划的一部分。

三星CFO Soon-Cheol Park强调,长期资本部署将与行业扩张保持一致,并指出“由于强劲的AI投资,内存需求将远超供应”,且“AI基础设施投资持续增长”。

“股价在财报公布期间下跌,因股东回报未带来上行惊喜,”Hwang总结道,并指出市场反应“凸显了在预期高企的股市中航行的真正挑战”。

​另见:

SK海力士公布受AI内存激增推动的创纪录第三季度业绩

三星公布AI内存路线图

智能手机制造商因芯片成本飙升而承压

DRAM、HBM、HBM4、内存芯片、移动设备、智能手机

MICRON、SAMSUNG ELECTRONICS、SK HYNIX

新闻台

供应链新闻台汇编与电子供应链相关的信息,包括行业报告和统计数据;物流数据、标准、治理和公司公告;人事通知及其他值得注意的事项。

Samsung Electronics reported third-quarter consolidated revenue of 195.3 trillion won (~$146 billion) and operating profit of 107.4 trillion won (~$80 billion). Strong global demand for AI memory chips underpinned the results.

Samsung said it is the first technology company globally to exceed 100 trillion won (~$75 billion) in quarterly operating profit, illustrating how AI infrastructure spending drives hardware economics across global supply chains.

However, rising component prices weighed on Samsung’s mobile business, while its shareholder return plans fell short of investor expectations.

Financial split between chips and consumer devices

The earnings report highlighted a stark contrast between Samsung’s component manufacturing and finished consumer electronics. The Device Solutions (DS) semiconductor division generated 147.1 trillion won (~$110 billion) in revenue and 106.5 trillion won (~$80 billion) in operating profit. In contrast, the Device eXperience (DX) division, which includes smartphones, televisions, and home appliances, posted an operating loss of 0.8 trillion won (~$0.6 billion) on revenue of 52.1 trillion won (~$39 billion).

By Dima Mymrikov, Sr. Director of GreenPAK Product Marketing, Renesas Electronics 10.29.2026

By Aaron Fellis, corporate vice president and general manager, Wet Equipment Technology Systems, Lam Research 10.26.2026

By Vasanth Sista, Field Application Engineer, TE Connectivity 10.26.2026

“Another record-breaking quarter, beating consensus estimates,” said MS Hwang, research director at Counterpoint Research, noting that semiconductor operating profit surpassed 100 trillion won (~$75 billion) while finished consumer set divisions slipped into an operating loss.

Memory pricing and supply chain adjustment

Memory pricing helped drive the divergence between Samsung’s semiconductor and consumer device businesses. Counterpoint Research argued that standard DRAM pricing rose from the historical range of 20-30 cents per gigabit to $2 per gigabit, expanding the global DRAM market to $200 billion. Samsung reported operating margins of 79% for DRAM and 72% for NAND flash. Meanwhile, as the high-bandwidth memory market (HBM) grows, HBM4 prices are expected to reach $4 per gigabit.

Higher memory prices put pressure on bill-of-materials across mobile manufacturing. Samsung’s Mobile eXperience (MX) and Networks business generated 37.7 trillion won (~$28.21 billion) in revenue but posted an operating loss of 0.6 trillion won (~$0.45 billion).

“The [consumer electronics] MX division continues to suffer from high memory pricing,” Hwang said. “Since low-end models are expected to continue losing money, Samsung may scale back its volume contribution, implying further correction in market volume dynamics in the supply chain.”

In the presentation before the earnings call, Samsung Mobile VP Daniel Araujo noted that the business aims to “mitigate profitability risks through efficiency improvements” and “improve our product mix centered on flagships.”

HBM expansion

Samsung’s results are consistent with those reported by SK Hynix, which posted third-quarter revenue of 104.62 trillion won (~$78 billion) and operating profit of 83.33 trillion won (~$62 billion).

Samsung’s HBM4 stacks (Source: Samsung)

The company said “it significantly scaled up sales of HBM4” on the back of product competitiveness while managing its “product mix, with focus on AI products, amid capacity constraints.”

During the earnings call, Jaejune Kim, EVP of Memory Business at Samsung Electronics, said the company has secured multi-year supply agreements with 10 key customers. However, while competitor SK Hynix stated that its HBM capacity is fully sold out through 2029, Samsung confirmed its HBM capacity is currently sold out through 2027.

Counterpoint Research expects Samsung to gain ground in advanced memory. “We anticipate that Samsung will surpass SK Hynix from the HBM4 generation, leading the market share in 2027,” Hwang said on SK Hynix results.

Capital allocation fuels investor pressure

Despite high operating income, Samsung’s share price fell during the earnings call as the capital allocation plan met expectations. The company announced a third-quarter cash dividend of 30 trillion won (~$22 billion) as part of an estimated total shareholder return plan of 90 trillion won (~$67 billion) to 110 trillion won (~$82 billion) for 2026.

Samsung CFO Soon-Cheol Park highlighted that long-term capital deployment will remain aligned with industry expansion, noting that “memory demand will far exceed supply due to robust AI investment” and “AI infrastructure investment continues to grow”.

“Shares declined during the earnings announcement as shareholder returns offered no upside surprise,” Hwang concluded, pointing out that the market reaction “highlights the real challenge of navigating an equity market with elevated expectations.”

​See also:

SK Hynix Reports Record Q3 Results Driven by AI Memory Surge

Samsung Lays Out AI Memory Roadmap

Smartphone Makers Squeezed by Soaring Chip Costs

DRAM, HBM, HBM4, MEMORY CHIPS, MOBILE DEVICES, SMARTPHONES

MICRON, SAMSUNG ELECTRONICS, SK HYNIX

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